ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 02, 2025 EDT
Metallization of High-Aspect Ratio Vias on Advanced IC-Substrates Using a Novel Liquid Metal Ink
Metallization of High-Aspect Ratio Vias on Advanced IC-Substrates Using a Novel Liquid Metal Ink
Kao, Sue, Siyang Liu, Hongbin Yu, Simon McElrea, Gibran Liezer Esquenazi, and Sunity Sharma. 2025. “Metallization of High-Aspect Ratio Vias on Advanced IC-Substrates Using a Novel Liquid Metal Ink.” IMAPSource Proceedings 2025 (DPC): 474–307. https://doi.org/10.4071/001c.151766.