Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding

Jianwen Han; Pingping Ye; Stephan Braye; Abdelhamid ElSawy; Harshul Khanna; Veronica Lambert; Adam Letize; Kyle Whitten; Thomas Richardson; Elie Najjar

doi:10.4071/001c.153869

Han, Jianwen, Pingping Ye, Stephan Braye, Abdelhamid ElSawy, Harshul Khanna, Veronica Lambert, Adam Letize, Kyle Whitten, Thomas Richardson, and Elie Najjar. 2025. “Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding.” IMAPSource Proceedings 2025 (DPC): 824–41. https://doi.org/10.4071/001c.153869.

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