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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2025, Issue DPC, 2025November 19, 2025 EDT

QFN Reimagined: Molded Fan-out Panel Solutions for Cost Efficiency and Scalability

Chevie Castillo, Robin Davis,
Leadframe-based QFNWettable Flanksmanufacturing efficiency
https://doi.org/10.4071/001c.151182
IMAPSource Conference Papers
Castillo, Chevie, and Robin Davis. 2025. “QFN Reimagined: Molded Fan-out Panel Solutions for Cost Efficiency and Scalability.” IMAPSource Proceedings 2025 (DPC): 64–92. https:/​/​doi.org/​10.4071/​001c.151182.

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