ISSN 2380-4505
Vol. 2025, Issue DPC, 2025November 19, 2025 EDT
Advanced Packaging Innovations for AI and HPC Enhancing Performance with SiCN for Hybrid Bonding and SiN or SiON for Wafer Flatness Optimization
Advanced Packaging Innovations for AI and HPC Enhancing Performance with SiCN for Hybrid Bonding and SiN or SiON for Wafer Flatness Optimization
ElGhazzali, Mohamed, Markus Frei, Roland Rettenmeier, Kenton Read, Ewald Strolz, Riccardo Morciano, and Patrick Carazzetti. 2025. “Advanced Packaging Innovations for AI and HPC Enhancing Performance with SiCN for Hybrid Bonding and SiN or SiON for Wafer Flatness Optimization.” IMAPSource Proceedings 2025 (DPC): 1384–98. https://doi.org/10.4071/001c.147791.