Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding Wires

Noritoshi Araki; Yasutomo Ichiyama; Ryo Oishi; Teruo Haibara; Takashi Yamada

doi:10.4071/isom-TP41

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Araki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, Teruo Haibara, and Takashi Yamada. 2014. “Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding Wires.” IMAPSource Proceedings 2014 (1): 272–77. https://doi.org/10.4071/isom-TP41.

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