ISSN 2380-4505
Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding Wires
Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding Wires
Araki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, Teruo Haibara, and Takashi Yamada. 2014. “Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding Wires.” IMAPSource Proceedings 2014 (1): 272–77. https://doi.org/10.4071/isom-TP41.