Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Solder Joint Reliability Assessment for a High Performance RF Ceramic Package
Solder Joint Reliability Assessment for a High Performance RF Ceramic Package
Charbonneau, Paul, Hans Ohman, and Marc Fortin. 2014. “Solder Joint Reliability Assessment for a High Performance RF Ceramic Package.” IMAPSource Proceedings 2014 (1): 62–67. https://doi.org/10.4071/isom-TA26.