PMV (Plating Mold Via) interconnection development in molded SiP modules

Do-Jae Yoo; Jong-In Ryu; Gyu-Hwan Oh; Yong-Choon Park; Ki-Ju Lee; Jin-Su Kim; Jong-Woo Choi; Ki-Chan Kim; Il-Hyeong Lee; Tae-Sung Kang; Peter Lim

doi:10.4071/isom-THP11

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Yoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi, et al. 2014. “PMV (Plating Mold Via) Interconnection Development in Molded SiP Modules.” IMAPSource Proceedings 2014 (1): 777–82. https://doi.org/10.4071/isom-THP11.

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