PMV (Plating Mold Via) interconnection development in molded SiP modules

Yoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi, et al. 2014. “PMV (Plating Mold Via) Interconnection Development in Molded SiP Modules.” IMAPSource Proceedings 2014 (1): 777–82. https:/​/​doi.org/​10.4071/​isom-THP11.