ISSN 2380-4505
Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Large Laminate and Die Coreless Substrate Packaging with Lid Ties
Large Laminate and Die Coreless Substrate Packaging with Lid Ties
Articles in Vol. 2014, Issue 1, 2014
Vol. 2014, Issue 1, 2014
- Parametric Studies of Effects of Solder Bump Pitch, Package Size, and Molding Compound and Substrate Thicknesses on Warpage of PBGA PackagesSungbum KangI. Charles Ume
- Adhesive Enhancement Technology for Directly Metal Plating on EMCKenichiroh MukaiKwonil KimBrian EastepLee GahertyAnirudh Kashyap
- Consumable Anode Process for SnAg ElectroplatingMarvin BerntAdam McClure
- TSV Etching Process For High Capacitor And TSV Reliable Integration.Takahide MurayamaToshiyuki SakuishiYasuhiro MorikawaNoriaki TaniKazuya Saitou
- PRESSURELESS SINTERING OF NANO- AG PASTE WITH LOW POROSITY FOR DIE ATTACHSihai ChenGuangyu FanXue YanChris LaBarberaLee KresgeNing-Cheng Lee
- PWB Z Interconnect Technology - Electrical PerformanceChase CarverNorman SeastrandRobert Welte
- Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly ProcessK. MacurovaR. BermejoM. PletzR. SchöngrundnerT. AntretterT. KrivecM. MorianzM. BrizouxA. Lecavelier
- Precision Jetting of Solder Paste – A Versatile Tool for Small Volume ProductionK.-F. BeckerM. KochS. VogesT. ThomasM. FliessJ. BauerT. BraunR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow ProcessingDaniel J. DuffyLin XinJean LiuBruno Tolla
- Multi-scale X-ray tomography for process and quality control in 3D TSV packagingEhrenfried ZschechSven NieseMarkus LöfflerM. Jürgen Wolf
- Direct Write Electronics – Thick Films on LTCCTim EastmanAdam Cook
- Packaging Design and Assembly for Ultrahigh Energy Density MicrobatteriesCaroline K. BjuneThomas F. MarinisYet-Ming Chiang
- DBC Switch Module for Management of Temperature and Noise in 220-W/in3 Power AssemblyWoochan KimJongwon ShinKhai D. T. Ngo
- Determination of LTCC Shrinkage Variations from Tape Manufacturer to ConsumerJames KupferschmidtMichael GirardiBrent DuncanDaren Whitlock
- Reliability Assessment of Flip-chip Assembly of Al BumpsHidekazu TANISAWAKohei HIYAMATakeshi ANZAIHiroki TAKAHASHIYoshinori MURAKAMIShinji SATOKinuyo WATANABEFumiki KATOHiroshi SATO
- Design and Direct Assembly of 2.5D/3D Rigid Silicon Interposer on PCBFarhang Yazdani
- Reliability of PCB Solder Joints Assembled with SACm™ Solder PasteArnab DasguptaFengying ZhouChristine LaBarberaWeiping LiuPaul BachorikNing-Cheng Lee
- Comparison of Fabrication Process Capability and Electrical Performance with Silicon and Glass InterposersSatoru KuramochiSumio KoiwaTakamasa TakanoMiyuki AkazawaHiroshi MawatariKousuke SuzukiYoshitaka Fukuoka
- Thermal Modeling of Large Embedded GaN TransistorsJ. RobertsG. KlowakN. Renaud-BezotL. Yushyna
- Photonic Interconnects for Data CentersTolga TekinAndreas HakanssonNikos PlerosDimitris Apostolopoulos
- Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-PackageRajesh KatkarRey CoWael Zohni
- Reliability potential of silicone molding compounds for LED applicationYue ShaoYu-chou ShihFrank G. Shi
- 160 MILLI-OHM ELECTRICAL RESISTANCE THRU-WAFER INTERCONNECTS WITH 10:1 ASPECT RATIOA. EfimovskayaA.M. Shkel
- Advanced Build-up Materials and Processes for Packages with Fine Line and SpaceYoshio NishimuraHirohisa NarahashiShigeo NakamuraTadahiko Yokota
- Reliability of LTCC using Electroless Nickel Immersion Gold (ENIG) Plating TechnologyPatricia GraddyAllan BeikmohamadiDeepukumar NairBrad ThrasherJames Parisi
- SNaP: A Process for Achieving Adhesion between Electroless Copper and Dielectrics with Minimal Surface RougheningMeng HsiehEllina LibmanLutz Brandt
- Assembly and Scaling Challenges for 2.5D ICLiang WangCharles G. WoychikGuilian GaoScott McGrathHong ShenEric TosayaSitaram Arkalgud
- Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume ManufacturingJin You ZaoBong Yin YenLim Beng KuanJohn ThornellDarcy HartDavid Marx
- Large Laminate and Die Coreless Substrate Packaging with Lid TiesEdmund BlackshearBrian W QuinlanBenjamin FasanoDavid J LewisonShidong LiHugues C GagnonPaul FortierRichard HeathFrederick RoyElaine Cyr Takashi NakajimaYoichi MiyazawaItsuroh ShishidoTomoyuki Yamada
- Large Form Factor Hybrid LGA Interconnects; Recent Applications and Technical LearningJohn TorokBrian BeamanWilliam BrodskyShawn CanfieldJason EagleTheron LewisMark HoffmeyerArvind SinhaYuet-Ying Yu
- Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.Kiran VanamAnthony NewmanMori PoustinchiStephen Stewart
- Challenges and Solutions in Preparation for High Resolution Failure Analysis of Power ElectronicsRobert KlengelSandy KlengelBianca Böttge
- SEM-based X-ray tomography of sub-micrometer defects in 3D integrationD. LaloumC. RibièreM. GottardiT. MourierF. LorutP. Bleuet
- Cost Analysis of TSV Process and Scaling OptionsVictor VartanianLarry SmithKlaus HummlerSteve OlsonBrian SappTyler BarberaSteve GolovatoKai-Hung YuToshio HasegawaShan HuGert LeusinkKaoru MaekawaJack EnloeAlison GraciasGyanaranjan PattanaikFred Wafula
- Improved Fabrication of Micro Channels in LTCC Circuitry and MEMS Using QPAC® Polyalkylene Carbonate as a Sacrificial StructurePeter Ferraro
- High Productivity Thermo-Compression Flip Chip BondingTom ColosimoHorst ClaubergEvan GalipeauMatthew B. WassermanMichael Schmidt-LangeBob Chylak
- Extreme Power Considerations for High Performance ComputingHow Lin
- Optical Characterization and Defect inspection for 3D stacked IC technologyGilles FresquetJean-Philippe Piel
- High-Temperature-Resistant Interconnection Using Nickel NanoparticlesYasunori TanakaSuguru HashimotoTomonori IizukaKohei TatsumiNorie MatsubaraShinji IshikawaMasamoto Tanaka
- How Can Millions of Aligned Graphene Layers Cool High Power Microelectronics?Wei FanAaron RapeXiang Liu
- Correlation between Thermo-mechanical Reliability and Superhydrophobic Nature of CNT Composite CoatingsYoonchul SohnDongouk KimSangeui LeeJae Yong SongSunghoon ParkHajin KimYoungchul KoKunmo ChuIntaek Han
- Reliability of Multi-Layer Wiring Board Embedded with Two Dies in Stacked ConfigurationKoji MunakataNobuki UetaMasahiro OkamotoKumi OnoderaKazu ItoiSatoshi OkudeOsamu NakaoTheodore (Ted) G. Tessier
- Zero Meta-material Ferroelectric Phase Shifter Embedded inside LTCCHossam TorkAicha ElshabiniFred Barlow
- FAILURE ANALYSIS OF DISCOLORED ENIG PADS IN THE MANUFACTURING ENVIRONMENTMonika MarciniakMichael MeagherJon DavisJack Josefowicz
- Fine Pitch Cu Wire Bonding Capability – Process Optimization and Reliability StudyIvy QinHui XuCuong HuynhBob ChylakHidenori AbeDongchul KangYoshinori EndoMasahiko OsakaShinya Nakamura
- Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions during Warpage Measurement of Unpainted PWB AssemblySungbum KangI. Charles Ume
- Thick Film Technology For Today's Hearing ProductsJohn DzarnoskiSusie Johansson
- The Design and Development of a 15 kV SiC Half-Bridge Multi-Chip Power Module for Medium Voltage ApplicationsZ. ColeJ. StabachG. FallingP. KilleenT. McNuttB. S. Passmore
- Nanofabricated Electronic ComponentsCarl EdwardsSungho JinCalvin Gardner
- Sandwich Structured Power Module for High Temperature SiC Power Semiconductor DevicesTakeshi ANZAIYoshinori MURAKAMIShinji SATOHidekazu TANISAWAKohei HIYAMAHiroki TAKAHASHIFumiki KATOHiroshi SATO
- Development of a stress compensation layer for thin pixel modules 3D assemblyG. ParesT. McMullenS. ToméL. VignoudR. BatesC. Buttar
- Heavy-Wire Bond Manipulation with Laser to Increase Reliability and as Enabler for Thermography based On-line Process ControlAndreas MiddendorfKlaus Dieter Lang
- Development of Glass Interposer with Fine-Pitch Micro Bumps and Warpage Study Depending on Several Glass Substrates with Different CTE'sKenichi MoriNaoyuki KoizumiKei MurayamaMitsuhiro AizawaKoji NagaiToshinori Koyama
- Analysis method of tool topography change and identification of wear indicators for heavy copper wire wedge bondingPaul EichwaldWalter SextroSimon AlthoffFlorian EacockAndreas UngerTobias MeyerKarsten Guth
- Size Effect of Particulate Filler on Electrical Resistivity of Carbon Nanotube Polymer Composites: Transition of Excluded Volume EffectsSung-Hoon ParkJinyoung HwangDong-Jin YunSangeui LeeSang Hyun LeeInTaek Han
- Hashing Processors: A New Challenge for Power Package DesignT. S. TarterA. CarrascoN. DoG. FeltenW. NunnJ. Church
- Influence of Fabrication Process Parameters and Material Properties on Process Yield Performance on RF and Microwave Thin Film based Termination ResistorsAkhlaq RahmanFred OlingerMichael Howieson
- High Value Thin Wafer Support Technology for 3DICJared PettitAlman LawAlex BrewerJohn Moore
- Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic PackagingJohn M. LaufferKevin Knadle
- Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale PackageTomoyuki YamadaMasahiro FukuiKenji TeradaMasaaki HarazonoTeruya FujisakiSushumna IruvantiCharles CareyYi PanCharlie ReynoldsKamal SikkaBrian SundlofHilton ToyRebecca Wagner
- Analyses of PBGA Packaging under Strong VibrationYeong K. KimDo Soon Hwang
- High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass InterposerVenky SundaramJialing TongKaya DemirTimothy HuangAric ShoreyScott PollardRao Tummala
- Laser Ablation of Thin Films on LTCCM. A. GirardiK. A. PetersonP. T. ViancoR. GrondinD. Wieliczka
- Glass Substrates for Advanced PackagingAric ShoreyScott Pollard
- Measurement of Electrical Conductivity of Direct Digital Printed Conductive Traces Using Near-Field Microwave MicroscopyMaría F. Córdoba-ErazoEduardo A. Rojas-NastrucciThomas. M. Weller
- SIP with TSV for Class 1 Medical DevicesDoug Link
- Thermal analysis, design, and characterization of a reconfigurable switch matrix based on LTCC technology for satellite communicationsS. KaleemS. RentschT. WelkerJ. MüllerM.A. Hein
- Pre-applied Inter Chip Fill for 3D-IC JoiningY. KawaseM. IkemotoM. SugiyamaH. KiritaniF. MizutaniK. MatsumotoH. MoriY. Orii
- Advancements in Phenomenological Understanding of Thinning and Planarization Processes for TSV-Enabled 2.5-3D Device FabricationsFrank Wei
- Solder Joint Reliability Assessment for a High Performance RF Ceramic PackagePaul CharbonneauHans OhmanMarc Fortin
- Silver Paste with Nano-sized Glass Frits for Silicon Solar CellsYu-Chou ShihYue ShaoYeong-Her LinFrank G. Shi
- A Resealable Hermetic Packaging Technique for Silicon Microfluidic DevicesLilla Safford SmithGordon D. HoopleJim C. ChengAlbert P. Pisano
- PoP Technology for the Automotive IndustryJaimal WilliamsonKurt WachtlerDavid ChinMike Pierce
- Gold Wirebond on Discolored Bond PadsDerek AndrewsLevi HillHassan MasoodDurgasamanth PidikitiQutaiba KhalidStevan Hunter
- BENEFITS OF TRANSMISSION LINE METAL-INSULATOR-METAL CAPACITORS IN MASS PRODUCTION OF RF CIRCUITSCenk ATALANEyup TONGEL
- A Case Study of the Reliability of Copper Bond Wires In Plastic Encapsulated Integrated CircuitsKen Turner
- Electrical Characterization of Fibre-Reinforced Plastics by Atmospheric Plasma TechnologySchramm ReneReitberger ThomasFranke Joerg
- SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSESVictor VartanianKlaus HummlerSteve OlsonTyler BarberaKai-Hung YuShan HuAkira FujitaFred WafulaGyanaranjan PattanaikAlison GraciasLarry SmithJack EnloeGert LeusinkKenneth MatthewsKaoru MaekawaBrian Sapp
- The Importance of Effective Root Cause Analysis of Failures in High Reliability Microelectronics Applications: A Case StudyGwen Schulz
- High-brightness LEDs of big chip size on multi-layer interconnects with optimized thermal dissipation and optical performanceLiang WangGabe GuevaraGrant VillavicencioRoseann AlatorreHala ShabaRey CoEric Tosaya
- Silver plating for LED applications, technology, processes and production experience.Steven BurlingGary NichollsPeter ChristensenSadayuki NagatomoKazuhiko Shiokawa
- Interconnect and Packaging Techniques for System Integration of High Power Assemblies that Improve Assembly Efficiency and Design FlexibilityJoseph LynchRichard SchneiderAndy Longford
- Magnetic Field Imaging for Non-Destructive 3D Package Fault IsolationJan GaudestadDavid Vallett
- Vibration Testing as a Tool to Optimize the Configuration of the PCBsI. SzendiuchB. PsotaA. OtáhalM. Klapka
- A Small Feature-Sized Organic interposer for 2.1D Packaging SolutionsChristian RomeroJeongho LeeKyungseob OhKyoungmoo HarrYoungdo Kweon
- Analysis of crack length and crack position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element SimulationsShri Vishnu KandaswamyUlrich TetzlaffRobert DerixGordon Elger
- Impact of Grain Structure and Material Properties on Via Extrusion in 3-D InterconnectsTengfei JiangChenglin WuJay ImRui HuangPaul S. Ho
- CO2 SPRAY CLEANING AND OSEE NON-CONTACT INSPECTION FOR WIRE BOND PAD PREPARATIONDavid Jackson
- Methodology for Predicting BGA Warpage by Incorporating Metal Layer DesignSandeep ShantaramTorsten Hauck
- The Characteristics of Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Systems for Gold-free Wafer Bonding TechnologyKunmo ChuSunghee LeeChangyoul Moon
- Design of a Miniaturized Vibrating Beam Power ConverterThomas F. MarinisJoseph W. Soucy
- Reliability Study of Silver, Copper and Gold Wire Bonding on IC DeviceHongtao GaoJun LuRichard LuWei XinXiaojing XuHamza Yilmaz
- A New Package Structure for High Speed eStoragesHyejin KimSunghoon ChunJaeyeon HwangIlmok Kang
- High Resolution Patterning Technology to enable Panel Based Advanced PackagingKlaus RuhmerPhilippe CochetRoger McClearyNelson Chen
- Fine pitch Copper Pillar interconnection with C4 (Mass Reflow) ProcessingFernando Roa
- Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°CUday S. GotetiFrancy J. AkkaraRichard C. JaegerMichael C. HamiltonJeffrey C. Suhling
- Performance Assessment of a Low Temperature Polymer Conductor for Lead-Free Soldering ProcessesSteven GrabeySamson ShahbaziSarah GromanCatherine Munoz
- Ceramic Process Variation Impact on Electrical Design Of High Frequency ComponentsJerry AguirreHeather TalloHide ShigenobuJoe Uyesugi
- The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Copper FilmsTobias BernhardFrank BrüningRalf BrüningTanu SharmaDelilah BrownSebastian ZarwellCraig Bishop
- Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump PackagesBrian SchmaltzYukinari AbeKazuyuki Kohara
- SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONSMary LiuWusheng Yin
- A New Approach for Reliable and Compact 3D Integration of mmW Transceivers on Silicon Using High-Impedance Surface AntennasOssama EL BOUAYADIYann LAMYLaurent DUSSOPTBrigitte SOULIER
- Comparison of Measured and Modeled Lithographic Process Capabilities for 2.5D and 3D Applications Using a Step and Repeat CameraJames WebbRoger McClearyGerald LopezQing Tan
- Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer HandlingAmy Palesko
- Thermal Management Solutions for Network File Server Used in Avionics ApplicationsVicentiu GrosuChris LindgrenTamas VejszYa-Chi ChenAvijit Bhunia
- Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)Woon-Seong KwonSuresh RamalingamXin WuLiam MaddenC. Y. HuangHung-Hsien ChangChi-Hsin ChiuSteve ChiuStephen Chen
- Adhesion Enabling Technology for Reliable Metallization and Patterning of Glass InterposersSara HunegnawLutz BrandtHailuo FuZhiming LiuTafadzwa Magaya
- A Novel Thin Wafer Handling Technology to Enable Cost-Effective Fabrication of Through-Glass Via InterposersAlvin LeeJay SuKim ArnoldDongshun BaiBor Kai WangLeon TsaiAric ShoreyWen-Wei ShenChun-Hsien ChienHsiang-Hung ChangJen-Chun Wang
- Advanced Process Technology for 3D and 2.5D ApplicationsDoug SheltonTomii KumeCharles WangAlex HubbardCody MurrayRob DeLancey
- Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°CFrancy J. AkkaraUday S. GotetiRichard C. JaegerMichael C. HamiltonMichael J. PalmerJeffrey C. Suhling
- Photopatternable Laminate BCB DielectricCorey O'ConnorRobert BarrJeff CalvertAnupam ChoubeyMike GallagherElissei IagodkineJoon-Seok OhAndrew PolitisKevin Wang
- Substrate-integrated divider networks in LTCC with optimized tolerance / isolation properties for Ka-Band satellite systemsTobias KleinPeter UhligCarsten GünnerReinhard Kulke
- Custom Thickness Bare Die Availability of Any Product Through Device Extraction, Thinning, and UBM Pad Re-ConditioningErick M. Spory
- Causality Enforcement of High-Speed Interconnects via Periodic ContinuationsLyudmyla L. BarannykHazem A. AboutalebAicha ElshabiniFred Barlow
- Low Cost Glass Interposer DevelopmentYu-Hua ChenShaun HsuUrmi RayRavi ShenoyKwan-Yu LaiAric B. ShoreyRachel LuWindsor P. ThomasDyi-Chung Hu
- Development of 3D System-in-Package with TSV TechnologyShota MikiTakaharu YamanoSumihiro IchikawaMasaki SanadaMasato Tanaka
- Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding WiresNoritoshi ArakiYasutomo IchiyamaRyo OishiTeruo HaibaraTakashi Yamada
- Qualification of Automotive RF-IC PackagesMumtaz Y. Bora
- A Non-destructive Bulk Currency Detection System (BCDS) for Screening Smuggled CurrencyJ. R. StetterM.T. CarterM.W. FindlaySuiqiong LiMarc Papageorge
- Comparison of Aluminum Electrolytic Capacitor Lifetimes Using Accelerated Life TestingStephani GulbrandsenJoelle ArnoldGreg CaswellKen Cartmill
- Perfect Edge 3D™: Enabling Root-Cause Failure AnalysisSuzanne CostelloStewart McCracken
- Efficient Non-reagent Metrology for Modern TSV BathsMichael PavlovDanni LinEugene Shalyt
- Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module DevelopmentHaotao KeAdam MorganRonald AmanDouglas C Hopkins
- New Liquid Crystal Polymer Substrate For High Frequency ApplicationsMichael ZimmermanKeith SmithWilliam ScavuzzoMeredith DunbarDeepukumar NairThomas CarneyRichard WesselBrad ThrasherGlenn OliverJim Parisi
- Microstructural investigations of aluminum and copper wire bondsFlorian EacockMirko SchaperSimon AlthoffAndreas UngerPaul EichwaldFlorian HengsbachCarolin ZinnMartin Joachim HolzweissigKarsten Guth
- Compressive-Post Packaging of Double-Sided DieWoochan KimJia-Woei WuBill AlexanderSauvik ChowdhuryCollin HitchcockNga C. LeeJames J. Q. LuT. Paul ChowKhai D. T. Ngo
- Package-on-Package Design and Assembly Process Development for Size ReductionSyed Sajid AhmadMike ReichFred HaringLayne BergeKevin MattsonCherish Bauer-ReichBob GilbertsonGreg Strommen
- Impact of Bath Stability on Electroplated Cu for Through-Silicon-Vias (TSV) in a Controlled Manufacturing EnvironmentAnh NguyenKevin FealeyPeter ReillyGyanaranjan PattanaikAlison GraciasFred WafulaMichael FlynnJack Enloe
- Mechanical reliability of ceramic packages for active implantable medical devices - The IEC hammer testF. KohlerT. StieglitzM. Schuettler
- Capacitive-Based, Closed-Loop Frequency Control of Substrate-Integrated Cavity Tunable FiltersShahrokh SaeediWilliam S. WilsonTyler R. AshleyHjalti H. SigmarssonJuseop Lee
- Wafer Dicing Using Dry Etching on Standard Tapes and FramesDavid LishanThierry LazerandKenneth MackenzieDavid Pays-VolardLinnell MartinezGordy GrivnaJason DoubTed TessierGuy Burgess
- Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge BondsAndreas UngerWalter SextroSimon AlthoffPaul EichwaldTobias MeyerFlorian EacockMichael BrökelmannMatthias HunstigDaniel BolowskiKarsten Guth
- Managing Voids in Adhesives for Medical DevicesM. RualesJ. MercedR. Ramos
- Air-Cooled Heat Exchanger for High-Temperature Power ElectronicsScot K. WayeJason LustbaderMatthew MusselmanCharles King
- IMS (Injection Molded Solder) Technology with Liquid Photoresist for Ultra Fine Pitch BumpingToyohiro AokiKazushige ToriyamaHiroyuki MoriYasumitsu OriiJae-Woong NahSeiichirou TakahashiJun MukawaKouichi HasegawaShiro KusumotoKatsumi Inomata
- Thermal and EMI Performance of Composite Plastic Molded Heat Sinks and Hybrid TIM MaterialsAlpesh BhobeHerman ChuLynn ComiskeyXiangyang JiaoXiao Li
- Cost and Yield Comparison of Wafer-to-Wafer, Die-to-Wafer, and Die-to-Die BondingAmy PaleskoChet Palesko
- Composition and Form: How Feedthrough Design Affects Package HermeticityRichard R. Share
- High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur compoundsVarughese MathewSheila Chopin
- Backside Exposure of Small-Sized TSVs Using Si/Cu Grinding, CMP, Cap Layer Deposition, and Alkaline EtchingNaoya WatanabeMasahiro AoyagiDaisuke KatagawaTsubasa BandohEiichi Yamamoto
- Fast Etching of Microscale Structures by Bombardment with Electrosprayed NanodropletsEnric Grustan-GutierrezRafael Borrajo-PelaezManuel Gamero-Castaño
- Effects on the Reliability of Lead-Free Solder Joints under Harsh EnvironmentZhou HaiJiawei ZhangChaobo ShenCong ZhaoJohn L. EvansMicheal. J. Bozack.
- Hermetic Electrical Feedthroughs Based on the Diffusion of Platinum into SiliconLinda RudmannJuan S. OrdonezHans ZappeThomas Stieglitz
- Embedded Capacitive Filter Units in LTCC for the Protection of Active Implantable Medical DevicesJuan S. OrdonezVivek SinghFabian KohlerJennifer PfauThomas StieglitzMartin Schuettler
- PMV (Plating Mold Via) interconnection development in molded SiP modulesDo-Jae YooJong-In RyuGyu-Hwan OhYong-Choon ParkKi-Ju LeeJin-Su KimJong-Woo ChoiKi-Chan KimIl-Hyeong LeeTae-Sung KangPeter Lim
- Advancement in Thermosonic Bonding WireS. MuraliTark Yong DeokB. SenthilkumarZhang Xi
- p3D Micro Dispensing & Photonic Curing of Silver Nanoparticle Inks on Low Thermal Stability Molded Plastic PartsMichael MastropietroIan RawsonVahid AkhavanXudong ChenKen Church
- New Method for Mitigating Weave-induced Differential Skew in PWBsTaiga FukumoriTomoyuki AkahoshiDaisuke MizutaniMotoaki Tani
- Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip DevicesJoelle ArnoldSteph GulbrandsenNathan Blattau
Blackshear, Edmund, Brian W Quinlan, Benjamin Fasano, David J Lewison, Shidong Li, Hugues C Gagnon, Paul Fortier, et al. 2014. “Large Laminate and Die Coreless Substrate Packaging with Lid Ties.” IMAPSource Proceedings 2014 (1): 74–80. https://doi.org/10.4071/isom-TA32.