ISSN 2380-4505
Articles in Vol. 2014, Issue 1, 2014
Vol. 2014, Issue 1, 2014
- Parametric Studies of Effects of Solder Bump Pitch, Package Size, and Molding Compound and Substrate Thicknesses on Warpage of PBGA PackagesSungbum KangI. Charles Ume
- Adhesive Enhancement Technology for Directly Metal Plating on EMCKenichiroh MukaiKwonil KimBrian EastepLee GahertyAnirudh Kashyap
- Consumable Anode Process for SnAg ElectroplatingMarvin BerntAdam McClure
- TSV Etching Process For High Capacitor And TSV Reliable Integration.Takahide MurayamaToshiyuki SakuishiYasuhiro MorikawaNoriaki TaniKazuya Saitou
- PRESSURELESS SINTERING OF NANO- AG PASTE WITH LOW POROSITY FOR DIE ATTACHSihai ChenGuangyu FanXue YanChris LaBarberaLee KresgeNing-Cheng Lee
- PWB Z Interconnect Technology - Electrical PerformanceChase CarverNorman SeastrandRobert Welte
- Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly ProcessK. MacurovaR. BermejoM. PletzR. SchöngrundnerT. AntretterT. KrivecM. MorianzM. BrizouxA. Lecavelier
- Precision Jetting of Solder Paste – A Versatile Tool for Small Volume ProductionK.-F. BeckerM. KochS. VogesT. ThomasM. FliessJ. BauerT. BraunR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow ProcessingDaniel J. DuffyLin XinJean LiuBruno Tolla
- Multi-scale X-ray tomography for process and quality control in 3D TSV packagingEhrenfried ZschechSven NieseMarkus LöfflerM. Jürgen Wolf
- Direct Write Electronics – Thick Films on LTCCTim EastmanAdam Cook
- Packaging Design and Assembly for Ultrahigh Energy Density MicrobatteriesCaroline K. BjuneThomas F. MarinisYet-Ming Chiang
- DBC Switch Module for Management of Temperature and Noise in 220-W/in3 Power AssemblyWoochan KimJongwon ShinKhai D. T. Ngo
- Determination of LTCC Shrinkage Variations from Tape Manufacturer to ConsumerJames KupferschmidtMichael GirardiBrent DuncanDaren Whitlock
- Reliability Assessment of Flip-chip Assembly of Al BumpsHidekazu TANISAWAKohei HIYAMATakeshi ANZAIHiroki TAKAHASHIYoshinori MURAKAMIShinji SATOKinuyo WATANABEFumiki KATOHiroshi SATO
- Design and Direct Assembly of 2.5D/3D Rigid Silicon Interposer on PCBFarhang Yazdani
- Reliability of PCB Solder Joints Assembled with SACm™ Solder PasteArnab DasguptaFengying ZhouChristine LaBarberaWeiping LiuPaul BachorikNing-Cheng Lee
- Comparison of Fabrication Process Capability and Electrical Performance with Silicon and Glass InterposersSatoru KuramochiSumio KoiwaTakamasa TakanoMiyuki AkazawaHiroshi MawatariKousuke SuzukiYoshitaka Fukuoka
- Thermal Modeling of Large Embedded GaN TransistorsJ. RobertsG. KlowakN. Renaud-BezotL. Yushyna
- Photonic Interconnects for Data CentersTolga TekinAndreas HakanssonNikos PlerosDimitris Apostolopoulos
- Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-PackageRajesh KatkarRey CoWael Zohni
- Reliability potential of silicone molding compounds for LED applicationYue ShaoYu-chou ShihFrank G. Shi
- 160 MILLI-OHM ELECTRICAL RESISTANCE THRU-WAFER INTERCONNECTS WITH 10:1 ASPECT RATIOA. EfimovskayaA.M. Shkel
- Advanced Build-up Materials and Processes for Packages with Fine Line and SpaceYoshio NishimuraHirohisa NarahashiShigeo NakamuraTadahiko Yokota
- Reliability of LTCC using Electroless Nickel Immersion Gold (ENIG) Plating TechnologyPatricia GraddyAllan BeikmohamadiDeepukumar NairBrad ThrasherJames Parisi
- SNaP: A Process for Achieving Adhesion between Electroless Copper and Dielectrics with Minimal Surface RougheningMeng HsiehEllina LibmanLutz Brandt
- Assembly and Scaling Challenges for 2.5D ICLiang WangCharles G. WoychikGuilian GaoScott McGrathHong ShenEric TosayaSitaram Arkalgud
- Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume ManufacturingJin You ZaoBong Yin YenLim Beng KuanJohn ThornellDarcy HartDavid Marx
- Large Laminate and Die Coreless Substrate Packaging with Lid TiesEdmund BlackshearBrian W QuinlanBenjamin FasanoDavid J LewisonShidong LiHugues C GagnonPaul FortierRichard HeathFrederick RoyElaine Cyr Takashi NakajimaYoichi MiyazawaItsuroh ShishidoTomoyuki Yamada
- Large Form Factor Hybrid LGA Interconnects; Recent Applications and Technical LearningJohn TorokBrian BeamanWilliam BrodskyShawn CanfieldJason EagleTheron LewisMark HoffmeyerArvind SinhaYuet-Ying Yu
- Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.Kiran VanamAnthony NewmanMori PoustinchiStephen Stewart
- Challenges and Solutions in Preparation for High Resolution Failure Analysis of Power ElectronicsRobert KlengelSandy KlengelBianca Böttge
- SEM-based X-ray tomography of sub-micrometer defects in 3D integrationD. LaloumC. RibièreM. GottardiT. MourierF. LorutP. Bleuet
- Cost Analysis of TSV Process and Scaling OptionsVictor VartanianLarry SmithKlaus HummlerSteve OlsonBrian SappTyler BarberaSteve GolovatoKai-Hung YuToshio HasegawaShan HuGert LeusinkKaoru MaekawaJack EnloeAlison GraciasGyanaranjan PattanaikFred Wafula
- Improved Fabrication of Micro Channels in LTCC Circuitry and MEMS Using QPAC® Polyalkylene Carbonate as a Sacrificial StructurePeter Ferraro
- High Productivity Thermo-Compression Flip Chip BondingTom ColosimoHorst ClaubergEvan GalipeauMatthew B. WassermanMichael Schmidt-LangeBob Chylak
- Extreme Power Considerations for High Performance ComputingHow Lin
- Optical Characterization and Defect inspection for 3D stacked IC technologyGilles FresquetJean-Philippe Piel
- High-Temperature-Resistant Interconnection Using Nickel NanoparticlesYasunori TanakaSuguru HashimotoTomonori IizukaKohei TatsumiNorie MatsubaraShinji IshikawaMasamoto Tanaka
- How Can Millions of Aligned Graphene Layers Cool High Power Microelectronics?Wei FanAaron RapeXiang Liu
- Correlation between Thermo-mechanical Reliability and Superhydrophobic Nature of CNT Composite CoatingsYoonchul SohnDongouk KimSangeui LeeJae Yong SongSunghoon ParkHajin KimYoungchul KoKunmo ChuIntaek Han
- Reliability of Multi-Layer Wiring Board Embedded with Two Dies in Stacked ConfigurationKoji MunakataNobuki UetaMasahiro OkamotoKumi OnoderaKazu ItoiSatoshi OkudeOsamu NakaoTheodore (Ted) G. Tessier
- Zero Meta-material Ferroelectric Phase Shifter Embedded inside LTCCHossam TorkAicha ElshabiniFred Barlow
- FAILURE ANALYSIS OF DISCOLORED ENIG PADS IN THE MANUFACTURING ENVIRONMENTMonika MarciniakMichael MeagherJon DavisJack Josefowicz
- Fine Pitch Cu Wire Bonding Capability – Process Optimization and Reliability StudyIvy QinHui XuCuong HuynhBob ChylakHidenori AbeDongchul KangYoshinori EndoMasahiko OsakaShinya Nakamura
- Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions during Warpage Measurement of Unpainted PWB AssemblySungbum KangI. Charles Ume
- Thick Film Technology For Today's Hearing ProductsJohn DzarnoskiSusie Johansson
- The Design and Development of a 15 kV SiC Half-Bridge Multi-Chip Power Module for Medium Voltage ApplicationsZ. ColeJ. StabachG. FallingP. KilleenT. McNuttB. S. Passmore
- Nanofabricated Electronic ComponentsCarl EdwardsSungho JinCalvin Gardner
- Sandwich Structured Power Module for High Temperature SiC Power Semiconductor DevicesTakeshi ANZAIYoshinori MURAKAMIShinji SATOHidekazu TANISAWAKohei HIYAMAHiroki TAKAHASHIFumiki KATOHiroshi SATO
- Development of a stress compensation layer for thin pixel modules 3D assemblyG. ParesT. McMullenS. ToméL. VignoudR. BatesC. Buttar
- Heavy-Wire Bond Manipulation with Laser to Increase Reliability and as Enabler for Thermography based On-line Process ControlAndreas MiddendorfKlaus Dieter Lang
- Development of Glass Interposer with Fine-Pitch Micro Bumps and Warpage Study Depending on Several Glass Substrates with Different CTE'sKenichi MoriNaoyuki KoizumiKei MurayamaMitsuhiro AizawaKoji NagaiToshinori Koyama
- Analysis method of tool topography change and identification of wear indicators for heavy copper wire wedge bondingPaul EichwaldWalter SextroSimon AlthoffFlorian EacockAndreas UngerTobias MeyerKarsten Guth
- Size Effect of Particulate Filler on Electrical Resistivity of Carbon Nanotube Polymer Composites: Transition of Excluded Volume EffectsSung-Hoon ParkJinyoung HwangDong-Jin YunSangeui LeeSang Hyun LeeInTaek Han
- Hashing Processors: A New Challenge for Power Package DesignT. S. TarterA. CarrascoN. DoG. FeltenW. NunnJ. Church
- Influence of Fabrication Process Parameters and Material Properties on Process Yield Performance on RF and Microwave Thin Film based Termination ResistorsAkhlaq RahmanFred OlingerMichael Howieson
- High Value Thin Wafer Support Technology for 3DICJared PettitAlman LawAlex BrewerJohn Moore
- Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic PackagingJohn M. LaufferKevin Knadle
- Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale PackageTomoyuki YamadaMasahiro FukuiKenji TeradaMasaaki HarazonoTeruya FujisakiSushumna IruvantiCharles CareyYi PanCharlie ReynoldsKamal SikkaBrian SundlofHilton ToyRebecca Wagner
- Analyses of PBGA Packaging under Strong VibrationYeong K. KimDo Soon Hwang
- High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass InterposerVenky SundaramJialing TongKaya DemirTimothy HuangAric ShoreyScott PollardRao Tummala
- Laser Ablation of Thin Films on LTCCM. A. GirardiK. A. PetersonP. T. ViancoR. GrondinD. Wieliczka
- Glass Substrates for Advanced PackagingAric ShoreyScott Pollard
- Measurement of Electrical Conductivity of Direct Digital Printed Conductive Traces Using Near-Field Microwave MicroscopyMaría F. Córdoba-ErazoEduardo A. Rojas-NastrucciThomas. M. Weller
- SIP with TSV for Class 1 Medical DevicesDoug Link
- Thermal analysis, design, and characterization of a reconfigurable switch matrix based on LTCC technology for satellite communicationsS. KaleemS. RentschT. WelkerJ. MüllerM.A. Hein
- Pre-applied Inter Chip Fill for 3D-IC JoiningY. KawaseM. IkemotoM. SugiyamaH. KiritaniF. MizutaniK. MatsumotoH. MoriY. Orii
- Advancements in Phenomenological Understanding of Thinning and Planarization Processes for TSV-Enabled 2.5-3D Device FabricationsFrank Wei
- Solder Joint Reliability Assessment for a High Performance RF Ceramic PackagePaul CharbonneauHans OhmanMarc Fortin
- Silver Paste with Nano-sized Glass Frits for Silicon Solar CellsYu-Chou ShihYue ShaoYeong-Her LinFrank G. Shi
- A Resealable Hermetic Packaging Technique for Silicon Microfluidic DevicesLilla Safford SmithGordon D. HoopleJim C. ChengAlbert P. Pisano
- PoP Technology for the Automotive IndustryJaimal WilliamsonKurt WachtlerDavid ChinMike Pierce
- Gold Wirebond on Discolored Bond PadsDerek AndrewsLevi HillHassan MasoodDurgasamanth PidikitiQutaiba KhalidStevan Hunter
- BENEFITS OF TRANSMISSION LINE METAL-INSULATOR-METAL CAPACITORS IN MASS PRODUCTION OF RF CIRCUITSCenk ATALANEyup TONGEL
- A Case Study of the Reliability of Copper Bond Wires In Plastic Encapsulated Integrated CircuitsKen Turner
- Electrical Characterization of Fibre-Reinforced Plastics by Atmospheric Plasma TechnologySchramm ReneReitberger ThomasFranke Joerg
- SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSESVictor VartanianKlaus HummlerSteve OlsonTyler BarberaKai-Hung YuShan HuAkira FujitaFred WafulaGyanaranjan PattanaikAlison GraciasLarry SmithJack EnloeGert LeusinkKenneth MatthewsKaoru MaekawaBrian Sapp
- The Importance of Effective Root Cause Analysis of Failures in High Reliability Microelectronics Applications: A Case StudyGwen Schulz
- High-brightness LEDs of big chip size on multi-layer interconnects with optimized thermal dissipation and optical performanceLiang WangGabe GuevaraGrant VillavicencioRoseann AlatorreHala ShabaRey CoEric Tosaya
- Silver plating for LED applications, technology, processes and production experience.Steven BurlingGary NichollsPeter ChristensenSadayuki NagatomoKazuhiko Shiokawa
- Interconnect and Packaging Techniques for System Integration of High Power Assemblies that Improve Assembly Efficiency and Design FlexibilityJoseph LynchRichard SchneiderAndy Longford
- Magnetic Field Imaging for Non-Destructive 3D Package Fault IsolationJan GaudestadDavid Vallett
- Vibration Testing as a Tool to Optimize the Configuration of the PCBsI. SzendiuchB. PsotaA. OtáhalM. Klapka
- A Small Feature-Sized Organic interposer for 2.1D Packaging SolutionsChristian RomeroJeongho LeeKyungseob OhKyoungmoo HarrYoungdo Kweon
- Analysis of crack length and crack position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element SimulationsShri Vishnu KandaswamyUlrich TetzlaffRobert DerixGordon Elger
- Impact of Grain Structure and Material Properties on Via Extrusion in 3-D InterconnectsTengfei JiangChenglin WuJay ImRui HuangPaul S. Ho
- CO2 SPRAY CLEANING AND OSEE NON-CONTACT INSPECTION FOR WIRE BOND PAD PREPARATIONDavid Jackson
- Methodology for Predicting BGA Warpage by Incorporating Metal Layer DesignSandeep ShantaramTorsten Hauck
- The Characteristics of Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Systems for Gold-free Wafer Bonding TechnologyKunmo ChuSunghee LeeChangyoul Moon
- Design of a Miniaturized Vibrating Beam Power ConverterThomas F. MarinisJoseph W. Soucy
- Reliability Study of Silver, Copper and Gold Wire Bonding on IC DeviceHongtao GaoJun LuRichard LuWei XinXiaojing XuHamza Yilmaz
- A New Package Structure for High Speed eStoragesHyejin KimSunghoon ChunJaeyeon HwangIlmok Kang
- High Resolution Patterning Technology to enable Panel Based Advanced PackagingKlaus RuhmerPhilippe CochetRoger McClearyNelson Chen
- Fine pitch Copper Pillar interconnection with C4 (Mass Reflow) ProcessingFernando Roa
- Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°CUday S. GotetiFrancy J. AkkaraRichard C. JaegerMichael C. HamiltonJeffrey C. Suhling
- Performance Assessment of a Low Temperature Polymer Conductor for Lead-Free Soldering ProcessesSteven GrabeySamson ShahbaziSarah GromanCatherine Munoz
- Ceramic Process Variation Impact on Electrical Design Of High Frequency ComponentsJerry AguirreHeather TalloHide ShigenobuJoe Uyesugi
- The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Copper FilmsTobias BernhardFrank BrüningRalf BrüningTanu SharmaDelilah BrownSebastian ZarwellCraig Bishop
- Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump PackagesBrian SchmaltzYukinari AbeKazuyuki Kohara
- SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONSMary LiuWusheng Yin
- A New Approach for Reliable and Compact 3D Integration of mmW Transceivers on Silicon Using High-Impedance Surface AntennasOssama EL BOUAYADIYann LAMYLaurent DUSSOPTBrigitte SOULIER
- Comparison of Measured and Modeled Lithographic Process Capabilities for 2.5D and 3D Applications Using a Step and Repeat CameraJames WebbRoger McClearyGerald LopezQing Tan
- Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer HandlingAmy Palesko
- Thermal Management Solutions for Network File Server Used in Avionics ApplicationsVicentiu GrosuChris LindgrenTamas VejszYa-Chi ChenAvijit Bhunia
- Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)Woon-Seong KwonSuresh RamalingamXin WuLiam MaddenC. Y. HuangHung-Hsien ChangChi-Hsin ChiuSteve ChiuStephen Chen
- Adhesion Enabling Technology for Reliable Metallization and Patterning of Glass InterposersSara HunegnawLutz BrandtHailuo FuZhiming LiuTafadzwa Magaya
- A Novel Thin Wafer Handling Technology to Enable Cost-Effective Fabrication of Through-Glass Via InterposersAlvin LeeJay SuKim ArnoldDongshun BaiBor Kai WangLeon TsaiAric ShoreyWen-Wei ShenChun-Hsien ChienHsiang-Hung ChangJen-Chun Wang
- Advanced Process Technology for 3D and 2.5D ApplicationsDoug SheltonTomii KumeCharles WangAlex HubbardCody MurrayRob DeLancey
- Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°CFrancy J. AkkaraUday S. GotetiRichard C. JaegerMichael C. HamiltonMichael J. PalmerJeffrey C. Suhling
- Photopatternable Laminate BCB DielectricCorey O'ConnorRobert BarrJeff CalvertAnupam ChoubeyMike GallagherElissei IagodkineJoon-Seok OhAndrew PolitisKevin Wang
- Substrate-integrated divider networks in LTCC with optimized tolerance / isolation properties for Ka-Band satellite systemsTobias KleinPeter UhligCarsten GünnerReinhard Kulke
- Custom Thickness Bare Die Availability of Any Product Through Device Extraction, Thinning, and UBM Pad Re-ConditioningErick M. Spory
- Causality Enforcement of High-Speed Interconnects via Periodic ContinuationsLyudmyla L. BarannykHazem A. AboutalebAicha ElshabiniFred Barlow
- Low Cost Glass Interposer DevelopmentYu-Hua ChenShaun HsuUrmi RayRavi ShenoyKwan-Yu LaiAric B. ShoreyRachel LuWindsor P. ThomasDyi-Chung Hu
- Development of 3D System-in-Package with TSV TechnologyShota MikiTakaharu YamanoSumihiro IchikawaMasaki SanadaMasato Tanaka
- Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-coated Copper Bonding WiresNoritoshi ArakiYasutomo IchiyamaRyo OishiTeruo HaibaraTakashi Yamada
- Qualification of Automotive RF-IC PackagesMumtaz Y. Bora
- A Non-destructive Bulk Currency Detection System (BCDS) for Screening Smuggled CurrencyJ. R. StetterM.T. CarterM.W. FindlaySuiqiong LiMarc Papageorge
- Comparison of Aluminum Electrolytic Capacitor Lifetimes Using Accelerated Life TestingStephani GulbrandsenJoelle ArnoldGreg CaswellKen Cartmill
- Perfect Edge 3D™: Enabling Root-Cause Failure AnalysisSuzanne CostelloStewart McCracken
- Efficient Non-reagent Metrology for Modern TSV BathsMichael PavlovDanni LinEugene Shalyt
- Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module DevelopmentHaotao KeAdam MorganRonald AmanDouglas C Hopkins
- New Liquid Crystal Polymer Substrate For High Frequency ApplicationsMichael ZimmermanKeith SmithWilliam ScavuzzoMeredith DunbarDeepukumar NairThomas CarneyRichard WesselBrad ThrasherGlenn OliverJim Parisi
- Microstructural investigations of aluminum and copper wire bondsFlorian EacockMirko SchaperSimon AlthoffAndreas UngerPaul EichwaldFlorian HengsbachCarolin ZinnMartin Joachim HolzweissigKarsten Guth
- Compressive-Post Packaging of Double-Sided DieWoochan KimJia-Woei WuBill AlexanderSauvik ChowdhuryCollin HitchcockNga C. LeeJames J. Q. LuT. Paul ChowKhai D. T. Ngo
- Package-on-Package Design and Assembly Process Development for Size ReductionSyed Sajid AhmadMike ReichFred HaringLayne BergeKevin MattsonCherish Bauer-ReichBob GilbertsonGreg Strommen
- Impact of Bath Stability on Electroplated Cu for Through-Silicon-Vias (TSV) in a Controlled Manufacturing EnvironmentAnh NguyenKevin FealeyPeter ReillyGyanaranjan PattanaikAlison GraciasFred WafulaMichael FlynnJack Enloe
- Mechanical reliability of ceramic packages for active implantable medical devices - The IEC hammer testF. KohlerT. StieglitzM. Schuettler
- Capacitive-Based, Closed-Loop Frequency Control of Substrate-Integrated Cavity Tunable FiltersShahrokh SaeediWilliam S. WilsonTyler R. AshleyHjalti H. SigmarssonJuseop Lee
- Wafer Dicing Using Dry Etching on Standard Tapes and FramesDavid LishanThierry LazerandKenneth MackenzieDavid Pays-VolardLinnell MartinezGordy GrivnaJason DoubTed TessierGuy Burgess
- Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge BondsAndreas UngerWalter SextroSimon AlthoffPaul EichwaldTobias MeyerFlorian EacockMichael BrökelmannMatthias HunstigDaniel BolowskiKarsten Guth
- Managing Voids in Adhesives for Medical DevicesM. RualesJ. MercedR. Ramos
- Air-Cooled Heat Exchanger for High-Temperature Power ElectronicsScot K. WayeJason LustbaderMatthew MusselmanCharles King
- IMS (Injection Molded Solder) Technology with Liquid Photoresist for Ultra Fine Pitch BumpingToyohiro AokiKazushige ToriyamaHiroyuki MoriYasumitsu OriiJae-Woong NahSeiichirou TakahashiJun MukawaKouichi HasegawaShiro KusumotoKatsumi Inomata
- Thermal and EMI Performance of Composite Plastic Molded Heat Sinks and Hybrid TIM MaterialsAlpesh BhobeHerman ChuLynn ComiskeyXiangyang JiaoXiao Li
- Cost and Yield Comparison of Wafer-to-Wafer, Die-to-Wafer, and Die-to-Die BondingAmy PaleskoChet Palesko
- Composition and Form: How Feedthrough Design Affects Package HermeticityRichard R. Share
- High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur compoundsVarughese MathewSheila Chopin
- Backside Exposure of Small-Sized TSVs Using Si/Cu Grinding, CMP, Cap Layer Deposition, and Alkaline EtchingNaoya WatanabeMasahiro AoyagiDaisuke KatagawaTsubasa BandohEiichi Yamamoto
- Fast Etching of Microscale Structures by Bombardment with Electrosprayed NanodropletsEnric Grustan-GutierrezRafael Borrajo-PelaezManuel Gamero-Castaño
- Effects on the Reliability of Lead-Free Solder Joints under Harsh EnvironmentZhou HaiJiawei ZhangChaobo ShenCong ZhaoJohn L. EvansMicheal. J. Bozack.
- Hermetic Electrical Feedthroughs Based on the Diffusion of Platinum into SiliconLinda RudmannJuan S. OrdonezHans ZappeThomas Stieglitz
- Embedded Capacitive Filter Units in LTCC for the Protection of Active Implantable Medical DevicesJuan S. OrdonezVivek SinghFabian KohlerJennifer PfauThomas StieglitzMartin Schuettler
- PMV (Plating Mold Via) interconnection development in molded SiP modulesDo-Jae YooJong-In RyuGyu-Hwan OhYong-Choon ParkKi-Ju LeeJin-Su KimJong-Woo ChoiKi-Chan KimIl-Hyeong LeeTae-Sung KangPeter Lim
- Advancement in Thermosonic Bonding WireS. MuraliTark Yong DeokB. SenthilkumarZhang Xi
- p3D Micro Dispensing & Photonic Curing of Silver Nanoparticle Inks on Low Thermal Stability Molded Plastic PartsMichael MastropietroIan RawsonVahid AkhavanXudong ChenKen Church
- New Method for Mitigating Weave-induced Differential Skew in PWBsTaiga FukumoriTomoyuki AkahoshiDaisuke MizutaniMotoaki Tani
- Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip DevicesJoelle ArnoldSteph GulbrandsenNathan Blattau
Roberts, J., G. Klowak, N. Renaud-Bezot, and L. Yushyna. 2014. “Thermal Modeling of Large Embedded GaN Transistors.” IMAPSource Proceedings 2014 (1): 414–18. https://doi.org/10.4071/isom-WA23.