ISSN 2380-4505
Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Backside Exposure of Small-Sized TSVs Using Si/Cu Grinding, CMP, Cap Layer Deposition, and Alkaline Etching
Backside Exposure of Small-Sized TSVs Using Si/Cu Grinding, CMP, Cap Layer Deposition, and Alkaline Etching
Watanabe, Naoya, Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, and Eiichi Yamamoto. 2014. “Backside Exposure of Small-Sized TSVs Using Si/Cu Grinding, CMP, Cap Layer Deposition, and Alkaline Etching.” IMAPSource Proceedings 2014 (1): 19–23. https://doi.org/10.4071/isom-TA14.