This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:51926/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Comparison of Fabrication Process Capability and Electrical Performance with Silicon and Glass Interposers

Satoru Kuramochi, Sumio Koiwa, Takamasa Takano, Miyuki Akazawa, Hiroshi Mawatari, Kousuke Suzuki, Yoshitaka Fukuoka,
2.5DTSVTGVSilicon InterposerGlass InterposerHigh frequency electrical characteristics
https://doi.org/10.4071/isom-WA11
IMAPSource Conference Papers
Kuramochi, Satoru, Sumio Koiwa, Takamasa Takano, Miyuki Akazawa, Hiroshi Mawatari, Kousuke Suzuki, and Yoshitaka Fukuoka. 2014. “Comparison of Fabrication Process Capability and Electrical Performance with Silicon and Glass Interposers.” IMAPSource Proceedings 2014 (1): 376–81. https:/​/​doi.org/​10.4071/​isom-WA11.

View more stats

Powered by Scholastica, the modern academic journal management system