Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Effects on the Reliability of Lead-Free Solder Joints under Harsh Environment
Effects on the Reliability of Lead-Free Solder Joints under Harsh Environment
Hai, Zhou, Jiawei Zhang, Chaobo Shen, Cong Zhao, John L. Evans, and Micheal. J. Bozack. 2014. “Effects on the Reliability of Lead-Free Solder Joints under Harsh Environment.” IMAPSource Proceedings 2014 (1): 471–76. https://doi.org/10.4071/isom-WA41.