This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:20455/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge Bonds

Andreas Unger, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, Michael Brökelmann, Matthias Hunstig, Daniel Bolowski, Karsten Guth,
Pre-deformationultrasonic wire bondingnumerical simulationmaterial properties
https://doi.org/10.4071/isom-TP44
IMAPSource Conference Papers
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, Michael Brökelmann, Matthias Hunstig, Daniel Bolowski, and Karsten Guth. 2014. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” IMAPSource Proceedings 2014 (1): 289–94. https:/​/​doi.org/​10.4071/​isom-TP44.

View more stats

Powered by Scholastica, the modern academic journal management system