Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:57280/feed
Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT

Ultra-High Density RDL on Glass Core Substrate for Heterogenous Integration

Takamasa Takano, Satoru Kuramochi, Masaya Tanaka,
HPChigh-speed data transmissionhigh reliabilityfine line RDLglass core substratelarge panel size
https://doi.org/10.4071/001c.129747
IMAPSource Conference Papers
Takano, Takamasa, Satoru Kuramochi, and Masaya Tanaka. 2025. “Ultra-High Density RDL on Glass Core Substrate for Heterogenous Integration.” IMAPSource Proceedings 2024 (Symposium): 196–202. https:/​/​doi.org/​10.4071/​001c.129747.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system