Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Development of Virtual Material Approach for Modeling Viscoelasticity of Underfill in Flip Chip Packages
Development of Virtual Material Approach for Modeling Viscoelasticity of Underfill in Flip Chip Packages
Liu, Ning, Dariush Tari, Christian Nordhorn, Kail Shim, and Matthew Tsai. 2025. “Development of Virtual Material Approach for Modeling Viscoelasticity of Underfill in Flip Chip Packages.” IMAPSource Proceedings 2024 (Symposium): 266–71. https://doi.org/10.4071/001c.129748.