Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Numerical Simulation on Stress on C4 Bump Distribution of Silicon Interposer
Numerical Simulation on Stress on C4 Bump Distribution of Silicon Interposer
Chen, Haijie, Ziyao Bian, Tao Liu, Qiang Zhao, Yaojian Lin, and Jielei Xie. 2025. “Numerical Simulation on Stress on C4 Bump Distribution of Silicon Interposer.” IMAPSource Proceedings 2024 (Symposium): 285–89. https://doi.org/10.4071/001c.129751.