ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 03, 2025 EDT
In-air Cu Sintering with Partial Encapsulation System for SiC Power Module
In-air Cu Sintering with Partial Encapsulation System for SiC Power Module
Articles in Vol. 2024, Issue Symposium, 2024
Vol. 2024, Issue Symposium, 2024
- Demonstration of Integrated Solenoid Transformer Balun in Glass Substrate Utilizing TGVsJein YuInsup HanJongmin Yook
- New Interconnection Technologies Based on Ni Micro-plating Bonding for High-temperature Resistant Power Device PackagingMayu MiyagawaTakumi OnoderaMasayoshi NakagawaWEI XingKeiko KoshibaTomonori IizukaMasakazu InagakiIsamu MorisakoKohei Tatsumi
- Control of the Surface Modification of Epoxy Resin by VUV-Redox Method using Vacuum Ultraviolet LightS. EndoA. ShimizuK. Fukada
- Exploring Effective Thermal Conductivity and Thermal Resistance of Conductive Film Adhesive Bondline for High Power Density ApplicationsWeiyu ZhangStone ChengYuan Zhao
- In-air Cu Sintering with Partial Encapsulation System for SiC Power ModuleYehRi KimEunjin JoDongjin Kim
- Effect of Bonding Pressure on Thermal Performance of Graphene-enhanced Thermal Interface Materials for Immersion Cooling ApplicationsKristoffer HarrYuanyuan WangKurban YasinJiabin ChenJin ChenJohan MöllerJohan Liu
- Liquid Metal Jetting for High-Performance Computing ApplicationsSunny AgarwalMiloš Lazić
- Printable Epoxy Paste for Varistor ApplicationsNicholas KrascoPaul CzubarowZhixiang LuArianna RothfussScott CopelandTony BarreteToshiyuki SatoKazunari Imai
- Ultra-low Loss Build-up Film Dielectric for Advanced PackagingYuya SuzukiMami NosakaKazutaka NakadaKazuyoshi Yoneda
- Using a Novel Co-Design Prototyping Approach for System-in-Package DevicesMatthew MonroeGokul KumarJustin LockeKeith Felton
- Optimizing Chiplet Disaggregation with Package TechnologyTrent UehlingJulian PontesCarl CulshawKarl Leiss
- Molded SiP Manufacturing with Integrated Shielding Layer for Optimized EMI RobustnessKarl-Friedrich BeckerS. VogesL. BeckerG. SafakO. NallawegF. MüllerChristian TschobanMarc DreissigackerM. A. YounisR. MaretzkiM. WallrodtTanja BraunMartin Schneider-Ramelow
- HPC Packaging Platform Including Compression MoldingMarius AdlerKarl-Friedrich BeckerTanja BraunMarc DreissigackerOle HoelckA. GaeblerUwe MaassIvan NdipK. ZoschkeMichael SchifferMartin Schneider-Ramelow
- The Quarter Factor Prediction of Mold Void Mechanism between Structure Ratio and Molding GateTzu Chieh ChienShih Kun LoZong Yuan LiMin Yen HsuYen Hua KuoHui Chung LiuLu Ming LaiKuang Hsiung Chen
- Multi NoC Performance Driven Exploration on FPGA SoC for Industrial ApplicationsDaksha SharmaPritam MajumderMikhail GaleevJohanan Agarwal
- Study of the Effect of Gravity Weight on Strip WarpageElizabeth FortinNathan WhitchurchWei LinEunSook Sohn
- Multiphysics Reliability Simulation and Validation of a Flip-Chip Build-Up Film Crack via Piezoresistive Stress SensorYutaka SuzukiJaimal WilliamsonBlake TravisTobias FritzCynthia ChapaRajen Murugan
- Electrolytic Deflash & High-pressure Water Jet Simulation Driven Delamination Risk Assessment in Plastic PackagesSharan KishoreYaxiong ChenTorsten HauckDavid Dougherty
- Effects of Constraints on Solder Joint Reliability of Electronic PackagesArvind PurushotamanNatalie RainesMasoud AngasRobert ManzanaresNathan Blattau
- Evaluation and Process Optimization of Heat-Curable Thermal Interface Materials for Advanced PackagesKevin CoxJoanna PainterGhassan Abu-hamdehSteven TonthatMatt BordenJason Krantz
- Solder Joint Reliability of Glass Core Substrate AssemblyJohn H LauNing LiuMike MaTzyy-Jang Tseng
- Thermal Expansion Control of Printed Circuit Boards Using Copper-Molybdenum Composite MaterialsYohei ItoKenjiro TakanishiTatsuya SakamotoKeisuke FujiwaraHitoshi Arai
- Prediction of an Industrial Framework for Semiconductor Fabrication and Experimental Validation OF 300 mm WaferDa-Woon JeongSe-hyun ChaTae-Hyun KimWangyu GwakYangwook ChoiHyeongGeun AnEun-Ho Lee
- LidroCUT – Ultrashort-pulsed Laser Processing in Liquids for Clean Dicing in One Process StepJan-Philipp WesselsKatharina LaakeJan Stefan HoppiusAlexander Kanitz
- High Performance and Cost-Effective Wafer Bumping Approach with Solder Paste Printing for Small LED DieHanWen ZhangGuo An "Andy" LiKung Chuan "Kenny" ChiongHui Kai "Vito" HsuB. Senthil KumarChze Min "Jason" LimThiam Chye Lim
- Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous IntegrationC. LinJ. H. LauC. ChenH. YangT. XiaC. KoB. LinM. MaT. Tseng
- Development of High Density, Enhanced Reliability Wafer Level PackagesGaurav SharmaMengYao SuVarun ThukralCraig BeddingfieldNishant Lakhera
- Low Warpage Liquid Compression Molded Underfill for Wafer Level PackagingYijia MaJimmy NguyenRose HaMark HoshiyamaTim ChampagneKail ShimRaj Peddi
- Trace Fusing Current Simulation in the Redistribution Layer of Wafer Level PackagesNathan WhitchurchJeongMin JuJiYeon YoonEunSook SohnKyungRok Park
- Enabling High-density Heterogeneous Integration using Wafer-scale Chiplet Reconstitution TechnologyAshita VictorMuhannad S. Bakir
- Advancing Semiconductor Packaging: Intelligent Architectures for Heterogeneous Integration AssemblyGlenn Farris
- Panel-level Fan-out: Relationship Between Panel Size and Cost ReductionAmy Lujan
- Novel Approach Solder Paste Printing on 90μm Pitch ApplicationB. Senthil KumarLim Chze (Jason) MinYam Lip HueiZhang Rui FenEdrina Risson OlakkankalZhang Rui HanWenKang Sungsig SS
- Investigation for the Influences of Factors Within the Semi-Additive Process (SAP) on Nanovoid Formation in the Cu-Cu Interface by STEM AnalysisKanji MatsumotoHisamitsu Yamamoto
- Difference Between 85 °C/85 %RH Accelerated Life Test and Pressure Cooker Test on Copper/Epoxy BondingRan LiuShuaijie ZhaoChuantong ChenYang LiuMinoru UeshimaHirose SuzukiHiroto TakenakaKatsuaki Suganuma
- Comparison of High-Frequency Transmission Characteristics of Transmission Lines on Copper-Plated Cycloolefin Polymer Using Directly Sputtered Copper Seed Layer and Electroless Copper Plating Seed LayerAkihiro ShimizuKazuhiro FukadaShinichi EndoMitsunori AbeAkiko Matsui
- On-Shore Assembly Solutions for Long-Lifecycle SystemsEdward Fontanilla
- High Performance mmWave Ribbon Bonding using 1x20 mil Gold RibbonDavid J. Rasmussen
- Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge PowerModuleGilberto MorenoJoshua MajorFaisal KhanSreekant Narumanchi
- Selecting Strip-Based or Singulated Laminates in Chiplet PackagingBrendan C. Wells
- Heterogeneous Integration Structure - FOSub for High End Product Substrate DevelopmentSheng LeeYan Wen ChungWen Hung HuangMin Lung HuangYue Nung LinJen Kuang Fang
- Substrate Warpage Study for Heterogeneous PackagesHoon JungDrake MillerGookJin Jung
- An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM)Debendra Das SharmaMichael Mingliang Liu
- Laser Assisted Bonding for Flip Chip Interconnection of Very Large ChipsCheikh Samba SarrDavid DanovitchMalak KansoPascale GagnonMarc-Olivier Pion
- Megachip: An Advanced Packaging Solution for Chiplet IntegrationRabindra N. DasJason PlantMatthew RicciRyan JohnsonPaul W. Juodawlkis
- An Innovative Approach for Advanced Packaging in 3D System Integration using Reconstructed Wafer-to-Wafer BondingSanghoon LeeKyounglim SukWoojin JangGwangjae JeonJaegun ShinDonghwi KimKwangjin MoonJaewha ParkSeokhyun LeeSujin Ahn
- Fan-Out Embedded Bridge with TSV (FO-EB-T) Package Solution for Enhancing HPC ApplicationSteven LinDavid HoYu-Po Wang
- Materials and Process Study for Polymer Hybrid BondingMasaya JukeiKota NomuraYugo TanigakiTakenori FujiwaraHitoshi ArakiTomoyuki HondaYu Shoji
- Optimizing Flip Chip Packaging for High Density Bump via Mold Flow Simulation with Through-HolesTzu Chieh ChienShih Kun LoZong Yuan LiChia Tso HsiehYen Hua KuoHui Chung LiuLu Ming LaiKuang Hsiung Chen
- Enhancing Signal Integrity in High-Performance Electronics through Advanced TGV Fabrication with LPKF's LIDE TechnologyRichard NoackRoman OstholtNils AnspachRafael SantosNorbert Ambrosius
- Fabrication and Passive Assembly of Broadband Evanescent Couplers for Sustainable Pbps Co-Packaged OpticsDrew WeningerSamuel SernaLuigi RannoLionel KimerlingAnuradha Agarwal
- Ultra-High Density RDL on Glass Core Substrate for Heterogenous IntegrationTakamasa TakanoSatoru KuramochiMasaya Tanaka
- Development of Virtual Material Approach for Modeling Viscoelasticity of Underfill in Flip Chip PackagesNing LiuDariush TariChristian NordhornKail ShimMatthew Tsai
- Using FEM Simulation to Predict the Mechanical and Thermal Performance of FO-EB-T PackageShane Lin LinVito LinTeny ShihAndrew KangY.P. Wang
- Characterization of Thermally-Enhanced Advanced Electronic Flip Chip CSP PackagesNahid Aslani AmoliKarthekeyan SridharSnehamay SinhaJaimal WilliamsonHiep NguyenArvin VerdeflorAyushi PradhanKathleen Timbol
- Numerical Simulation on Stress on C4 Bump Distribution of Silicon InterposerHaijie ChenZiyao BianTao LiuQiang ZhaoYaojian LinJielei Xie
- Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module PackageJacob WellsJie GengGuangyu Fan
- A Novel High Resolution Dry Film Photo-Imageable Dielectric for Redistribution Layer in Advanced Packaging ApplicationsGregory ProkopowiczYaming JiangColin HayesMichael GallagherMark ReynoldsAndrew LotzKevin WangZhou (Joe) LuChristopher Gilmore
- Enhancing Electrical Conductivity of Epoxy Resin Based Conductive Pastes Through the Use of NanoStrandTM SilverEhsan MarzbanradPeter SextonEduardo Gonzalez-Martinez
- Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam StructuresPatrick SchirmerSeverin RingelstetterKian Chong TaiMuizzuddin Azfar
- Next Generation Phase Change Material for High Power ElectronicsRita MohantyTho Quang Nguyen
- Applying Machine Learning to the Smart Welding of Cylindrical Lithium-ion Battery Cells within Battery ModulesMike McKeown
- Fine Gold and Coated-Ag Bonding Wire: Vertical Wire BondingSarangapani MuraliDhayalan MariyappanTuriano Alejandro Jr AdvinculaChong Mei Joanne HoeLim Yee Evonne WeonKang Sungsig SS
- Gas-free & Nano Al2O3-coated Ag Bonding Wire for Replacing Au WireSoojae ParkEunmin ChoSiyeong OhHongsik Kim
- Cause and Prevention of Large Void Formation in Flip Chip Solder ConnectionsJ. Ramirez RamosT. MarinisD. Hanson
- Advanced 3D Integrated Circuit Packaging: Metallurgical Improvement and FLOLA (Flux-Less Oxide-removal Laser Assembly) Process at a 9㎛-Pitch Micro-BumpSeok-Geun AhnJu-Hyeon OhGwang-Jae JeonDae-Ho LeeSun-Woo ChoiKyoung-A KimHyo-Kyeong YunJin-Young ChoiSeok-Hyun LeeSu-Jin Ahn
- Metastable Fine Grain Cu for Hybrid Bonding ApplicationsPingping YeJianwen HanStephan BrayeAbdelhamid ElSawyHarshul KhannaVeronica HayesAdam LetizeKyle WhittenThomas RichardsonElie Najjar
- Control of Cu Microstructure and Properties for Low-Temperature Direct Cu-Cu BondingCara GannettYoungmin YoonGabrielle PageDerek ThoresenBrian ParquetteMatthew GoleMatthew Van HanehemRavi Pokhrel
- Pitch Interconnection and Packaging Studies for Hybrid Electronics with Aerosol Jet Printed Particle-Free Ag InkAbdullah S. ObeidatDylan RichmondJordan Howard-JenningsAshraf UmarRiadh Al-HaidariMohammed AlhendiBehnam GarakaniDetlef-M. SmilgiesMark D. Poliks
- Ultra-Precise Dispensing in 3D Packaging: A Seamless Shift from R&D to ProductionNina SzczotkaAleksandra MotykaAleksandra ChudzyńskaMateusz ŁysieńAleksandra PerczyńskaAnna SzczurekŁukasz WitczakPiotr KowalczewskiAneta Wiatrowska
- The Effect of Conductor Processing and Properties on Additively Manufactured Antenna PerformanceEmuobosan EnakerakpoWaleed Tawfik Al-ShaibaniOlya Noruz ShamsianRiadh Al-HaidariAbdullah S. ObeidatAshraf UmarMohammed AlhendiMark Poliks
- Measurement-based Characterization and Application of Low-Loss Dielectric Materials for Development of 6G Sub-THz AntennasIvan NdipThi Huyen LeKavin Senthil MurugesanJens SchneiderLutz GerholdHabib HichriRyohei OishiReki NakanoMartin Schneider-Ramelow
- Processing Tank Flow Mechanics for Next Generation Glass Core SubstratesVladimir KudriavtsevRajeev BajajChris LaneZia Karim
- High-Performance Structures with Photo-Imageable Pastes for mmWave ApplicationsKathrin ReinhardtLynn RatajczakStefan KörnerUwe Partsch
- The Ideal Switch® with Advanced Glass PackagingAric ShoreyJeff BalounMark Walker
Kim, YehRi, Eunjin Jo, and Dongjin Kim. 2025. “In-Air Cu Sintering with Partial Encapsulation System for SiC Power Module.” IMAPSource Proceedings 2024 (Symposium): 450–54. https://doi.org/10.4071/001c.129284.