ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 03, 2025 EDT
In-air Cu Sintering with Partial Encapsulation System for SiC Power Module
In-air Cu Sintering with Partial Encapsulation System for SiC Power Module
Kim, YehRi, Eunjin Jo, and Dongjin Kim. 2025. “In-Air Cu Sintering with Partial Encapsulation System for SiC Power Module.” IMAPSource Proceedings 2024 (Symposium): 450–54. https://doi.org/10.4071/001c.129284.