Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Advanced 3D Integrated Circuit Packaging: Metallurgical Improvement and FLOLA (Flux-Less Oxide-removal Laser Assembly) Process at a 9㎛-Pitch Micro-Bump
Advanced 3D Integrated Circuit Packaging: Metallurgical Improvement and FLOLA (Flux-Less Oxide-removal Laser Assembly) Process at a 9㎛-Pitch Micro-Bump
Seok-Geun Ahn, Ju-Hyeon Oh, Gwang-Jae Jeon, Dae-Ho Lee, Sun-Woo Choi, Kyoung-A Kim, Hyo-Kyeong Yun, Jin-Young Choi, Seok-Hyun Lee, Su-Jin Ahn,
Ahn, Seok-Geun, Ju-Hyeon Oh, Gwang-Jae Jeon, Dae-Ho Lee, Sun-Woo Choi, Kyoung-A Kim, Hyo-Kyeong Yun, Jin-Young Choi, Seok-Hyun Lee, and Su-Jin Ahn. 2025. “Advanced 3D Integrated Circuit Packaging: Metallurgical Improvement and FLOLA (Flux-Less Oxide-Removal Laser Assembly) Process at a 9㎛-Pitch Micro-Bump.” IMAPSource Proceedings 2024 (Symposium): 103–7. https://doi.org/10.4071/001c.129764.