Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
A Novel High Resolution Dry Film Photo-Imageable Dielectric for Redistribution Layer in Advanced Packaging Applications
A Novel High Resolution Dry Film Photo-Imageable Dielectric for Redistribution Layer in Advanced Packaging Applications
Gregory Prokopowicz, Yaming Jiang, Colin Hayes, Michael Gallagher, Mark Reynolds, Andrew Lotz, Kevin Wang, Zhou (Joe) Lu, Christopher Gilmore,
Prokopowicz, Gregory, Yaming Jiang, Colin Hayes, Michael Gallagher, Mark Reynolds, Andrew Lotz, Kevin Wang, Zhou (Joe) Lu, and Christopher Gilmore. 2025. “A Novel High Resolution Dry Film Photo-Imageable Dielectric for Redistribution Layer in Advanced Packaging Applications.” IMAPSource Proceedings 2024 (Symposium): 396–401. https://doi.org/10.4071/001c.129754.