New Interconnection Technologies Based on Ni Micro-plating Bonding for High-temperature Resistant Power Device Packaging

Miyagawa, Mayu, Takumi Onodera, Masayoshi Nakagawa, WEI Xing, Keiko Koshiba, Tomonori Iizuka, Masakazu Inagaki, Isamu Morisako, and Kohei Tatsumi. 2025. “New Interconnection Technologies Based on Ni Micro-Plating Bonding for High-Temperature Resistant Power Device Packaging.” IMAPSource Proceedings 2024 (Symposium): 425–29. https:/​/​doi.org/​10.4071/​001c.129277.