Optimizing Flip Chip Packaging for High Density Bump via Mold Flow Simulation with Through-Holes

Chien, Tzu Chieh, Shih Kun Lo, Zong Yuan Li, Chia Tso Hsieh, Yen Hua Kuo, Hui Chung Liu, Lu Ming Lai, and Kuang Hsiung Chen. 2025. “Optimizing Flip Chip Packaging for High Density Bump via Mold Flow Simulation with Through-Holes.” IMAPSource Proceedings 2024 (Symposium): 73–76. https:/​/​doi.org/​10.4071/​001c.129738.