Megachip: An Advanced Packaging Solution for Chiplet Integration

Rabindra N. Das; Jason Plant; Matthew Ricci; Ryan Johnson; Paul W. Juodawlkis

doi:10.4071/001c.129732

Das, Rabindra N., Jason Plant, Matthew Ricci, Ryan Johnson, and Paul W. Juodawlkis. 2025. “Megachip: An Advanced Packaging Solution for Chiplet Integration.” IMAPSource Proceedings 2024 (Symposium): 47–55. https://doi.org/10.4071/001c.129732.

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Megachip: An Advanced Packaging Solution for Chiplet Integration

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