Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM)
An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM)
Sharma, Debendra Das, and Michael Mingliang Liu. 2025. “An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM).” IMAPSource Proceedings 2024 (Symposium): 387–90. https://doi.org/10.4071/001c.129729.