ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 10, 2025 EDT
Trace Fusing Current Simulation in the Redistribution Layer of Wafer Level Packages
Trace Fusing Current Simulation in the Redistribution Layer of Wafer Level Packages
Whitchurch, Nathan, JeongMin Ju, JiYeon Yoon, EunSook Sohn, and KyungRok Park. 2025. “Trace Fusing Current Simulation in the Redistribution Layer of Wafer Level Packages.” IMAPSource Proceedings 2024 (Symposium): 161–67. https://doi.org/10.4071/001c.129615.