Vol. 2024, Issue Symposium, 2024February 03, 2025 EDT
Exploring Effective Thermal Conductivity and Thermal Resistance of Conductive Film Adhesive Bondline for High Power Density Applications
Exploring Effective Thermal Conductivity and Thermal Resistance of Conductive Film Adhesive Bondline for High Power Density Applications
Zhang, Weiyu, Stone Cheng, and Yuan Zhao. 2025. “Exploring Effective Thermal Conductivity and Thermal Resistance of Conductive Film Adhesive Bondline for High Power Density Applications.” IMAPSource Proceedings 2024 (Symposium): 444–49. https://doi.org/10.4071/001c.129283.