Cause and Prevention of Large Void Formation in Flip Chip Solder Connections

J. Ramirez Ramos; T. Marinis; D. Hanson

doi:10.4071/001c.129762

Ramos, J. Ramirez, T. Marinis, and D. Hanson. 2025. “Cause and Prevention of Large Void Formation in Flip Chip Solder Connections.” IMAPSource Proceedings 2024 (Symposium): 93–102. https://doi.org/10.4071/001c.129762.

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Cause and Prevention of Large Void Formation in Flip Chip Solder Connections

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