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Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 10, 2025 EDT

Investigation for the Influences of Factors Within the Semi-Additive Process (SAP) on Nanovoid Formation in the Cu-Cu Interface by STEM Analysis

Kanji Matsumoto, Hisamitsu Yamamoto,
electroless copper platingnanovoidsSAP processreliabilitytransmission electron microscopyPrinted Circuit Board
https://doi.org/10.4071/001c.129621
IMAPSource Conference Papers
Matsumoto, Kanji, and Hisamitsu Yamamoto. 2025. “Investigation for the Influences of Factors Within the Semi-Additive Process (SAP) on Nanovoid Formation in the Cu-Cu Interface by STEM Analysis.” IMAPSource Proceedings 2024 (Symposium): 348–57. https:/​/​doi.org/​10.4071/​001c.129621.
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