Multiphysics Reliability Simulation and Validation of a Flip-Chip Build-Up Film Crack via Piezoresistive Stress Sensor

Suzuki, Yutaka, Jaimal Williamson, Blake Travis, Tobias Fritz, Cynthia Chapa, and Rajen Murugan. 2025. “Multiphysics Reliability Simulation and Validation of a Flip-Chip Build-Up Film Crack via Piezoresistive Stress Sensor.” IMAPSource Proceedings 2024 (Symposium): 125–33. https:/​/​doi.org/​10.4071/​001c.129518.