ISSN 2380-4505
Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module Package
Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module Package
Articles in Vol. 2024, Issue Symposium, 2024
Vol. 2024, Issue Symposium, 2024
- Demonstration of Integrated Solenoid Transformer Balun in Glass Substrate Utilizing TGVsJein YuInsup HanJongmin Yook
- New Interconnection Technologies Based on Ni Micro-plating Bonding for High-temperature Resistant Power Device PackagingMayu MiyagawaTakumi OnoderaMasayoshi NakagawaWEI XingKeiko KoshibaTomonori IizukaMasakazu InagakiIsamu MorisakoKohei Tatsumi
- Control of the Surface Modification of Epoxy Resin by VUV-Redox Method using Vacuum Ultraviolet LightS. EndoA. ShimizuK. Fukada
- Exploring Effective Thermal Conductivity and Thermal Resistance of Conductive Film Adhesive Bondline for High Power Density ApplicationsWeiyu ZhangStone ChengYuan Zhao
- In-air Cu Sintering with Partial Encapsulation System for SiC Power ModuleYehRi KimEunjin JoDongjin Kim
- Effect of Bonding Pressure on Thermal Performance of Graphene-enhanced Thermal Interface Materials for Immersion Cooling ApplicationsKristoffer HarrYuanyuan WangKurban YasinJiabin ChenJin ChenJohan MöllerJohan Liu
- Liquid Metal Jetting for High-Performance Computing ApplicationsSunny AgarwalMiloš Lazić
- Printable Epoxy Paste for Varistor ApplicationsNicholas KrascoPaul CzubarowZhixiang LuArianna RothfussScott CopelandTony BarreteToshiyuki SatoKazunari Imai
- Ultra-low Loss Build-up Film Dielectric for Advanced PackagingYuya SuzukiMami NosakaKazutaka NakadaKazuyoshi Yoneda
- Using a Novel Co-Design Prototyping Approach for System-in-Package DevicesMatthew MonroeGokul KumarJustin LockeKeith Felton
- Optimizing Chiplet Disaggregation with Package TechnologyTrent UehlingJulian PontesCarl CulshawKarl Leiss
- Molded SiP Manufacturing with Integrated Shielding Layer for Optimized EMI RobustnessKarl-Friedrich BeckerS. VogesL. BeckerG. SafakO. NallawegF. MüllerChristian TschobanMarc DreissigackerM. A. YounisR. MaretzkiM. WallrodtTanja BraunMartin Schneider-Ramelow
- HPC Packaging Platform Including Compression MoldingMarius AdlerKarl-Friedrich BeckerTanja BraunMarc DreissigackerOle HoelckA. GaeblerUwe MaassIvan NdipK. ZoschkeMichael SchifferMartin Schneider-Ramelow
- The Quarter Factor Prediction of Mold Void Mechanism between Structure Ratio and Molding GateTzu Chieh ChienShih Kun LoZong Yuan LiMin Yen HsuYen Hua KuoHui Chung LiuLu Ming LaiKuang Hsiung Chen
- Multi NoC Performance Driven Exploration on FPGA SoC for Industrial ApplicationsDaksha SharmaPritam MajumderMikhail GaleevJohanan Agarwal
- Study of the Effect of Gravity Weight on Strip WarpageElizabeth FortinNathan WhitchurchWei LinEunSook Sohn
- Multiphysics Reliability Simulation and Validation of a Flip-Chip Build-Up Film Crack via Piezoresistive Stress SensorYutaka SuzukiJaimal WilliamsonBlake TravisTobias FritzCynthia ChapaRajen Murugan
- Electrolytic Deflash & High-pressure Water Jet Simulation Driven Delamination Risk Assessment in Plastic PackagesSharan KishoreYaxiong ChenTorsten HauckDavid Dougherty
- Effects of Constraints on Solder Joint Reliability of Electronic PackagesArvind PurushotamanNatalie RainesMasoud AngasRobert ManzanaresNathan Blattau
- Evaluation and Process Optimization of Heat-Curable Thermal Interface Materials for Advanced PackagesKevin CoxJoanna PainterGhassan Abu-hamdehSteven TonthatMatt BordenJason Krantz
- Solder Joint Reliability of Glass Core Substrate AssemblyJohn H LauNing LiuMike MaTzyy-Jang Tseng
- Thermal Expansion Control of Printed Circuit Boards Using Copper-Molybdenum Composite MaterialsYohei ItoKenjiro TakanishiTatsuya SakamotoKeisuke FujiwaraHitoshi Arai
- Prediction of an Industrial Framework for Semiconductor Fabrication and Experimental Validation OF 300 mm WaferDa-Woon JeongSe-hyun ChaTae-Hyun KimWangyu GwakYangwook ChoiHyeongGeun AnEun-Ho Lee
- LidroCUT – Ultrashort-pulsed Laser Processing in Liquids for Clean Dicing in One Process StepJan-Philipp WesselsKatharina LaakeJan Stefan HoppiusAlexander Kanitz
- High Performance and Cost-Effective Wafer Bumping Approach with Solder Paste Printing for Small LED DieHanWen ZhangGuo An "Andy" LiKung Chuan "Kenny" ChiongHui Kai "Vito" HsuB. Senthil KumarChze Min "Jason" LimThiam Chye Lim
- Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous IntegrationC. LinJ. H. LauC. ChenH. YangT. XiaC. KoB. LinM. MaT. Tseng
- Development of High Density, Enhanced Reliability Wafer Level PackagesGaurav SharmaMengYao SuVarun ThukralCraig BeddingfieldNishant Lakhera
- Low Warpage Liquid Compression Molded Underfill for Wafer Level PackagingYijia MaJimmy NguyenRose HaMark HoshiyamaTim ChampagneKail ShimRaj Peddi
- Trace Fusing Current Simulation in the Redistribution Layer of Wafer Level PackagesNathan WhitchurchJeongMin JuJiYeon YoonEunSook SohnKyungRok Park
- Enabling High-density Heterogeneous Integration using Wafer-scale Chiplet Reconstitution TechnologyAshita VictorMuhannad S. Bakir
- Advancing Semiconductor Packaging: Intelligent Architectures for Heterogeneous Integration AssemblyGlenn Farris
- Panel-level Fan-out: Relationship Between Panel Size and Cost ReductionAmy Lujan
- Novel Approach Solder Paste Printing on 90μm Pitch ApplicationB. Senthil KumarLim Chze (Jason) MinYam Lip HueiZhang Rui FenEdrina Risson OlakkankalZhang Rui HanWenKang Sungsig SS
- Investigation for the Influences of Factors Within the Semi-Additive Process (SAP) on Nanovoid Formation in the Cu-Cu Interface by STEM AnalysisKanji MatsumotoHisamitsu Yamamoto
- Difference Between 85 °C/85 %RH Accelerated Life Test and Pressure Cooker Test on Copper/Epoxy BondingRan LiuShuaijie ZhaoChuantong ChenYang LiuMinoru UeshimaHirose SuzukiHiroto TakenakaKatsuaki Suganuma
- Comparison of High-Frequency Transmission Characteristics of Transmission Lines on Copper-Plated Cycloolefin Polymer Using Directly Sputtered Copper Seed Layer and Electroless Copper Plating Seed LayerAkihiro ShimizuKazuhiro FukadaShinichi EndoMitsunori AbeAkiko Matsui
- On-Shore Assembly Solutions for Long-Lifecycle SystemsEdward Fontanilla
- High Performance mmWave Ribbon Bonding using 1x20 mil Gold RibbonDavid J. Rasmussen
- Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge PowerModuleGilberto MorenoJoshua MajorFaisal KhanSreekant Narumanchi
- Selecting Strip-Based or Singulated Laminates in Chiplet PackagingBrendan C. Wells
- Heterogeneous Integration Structure - FOSub for High End Product Substrate DevelopmentSheng LeeYan Wen ChungWen Hung HuangMin Lung HuangYue Nung LinJen Kuang Fang
- Substrate Warpage Study for Heterogeneous PackagesHoon JungDrake MillerGookJin Jung
- An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM)Debendra Das SharmaMichael Mingliang Liu
- Laser Assisted Bonding for Flip Chip Interconnection of Very Large ChipsCheikh Samba SarrDavid DanovitchMalak KansoPascale GagnonMarc-Olivier Pion
- Megachip: An Advanced Packaging Solution for Chiplet IntegrationRabindra N. DasJason PlantMatthew RicciRyan JohnsonPaul W. Juodawlkis
- An Innovative Approach for Advanced Packaging in 3D System Integration using Reconstructed Wafer-to-Wafer BondingSanghoon LeeKyounglim SukWoojin JangGwangjae JeonJaegun ShinDonghwi KimKwangjin MoonJaewha ParkSeokhyun LeeSujin Ahn
- Fan-Out Embedded Bridge with TSV (FO-EB-T) Package Solution for Enhancing HPC ApplicationSteven LinDavid HoYu-Po Wang
- Materials and Process Study for Polymer Hybrid BondingMasaya JukeiKota NomuraYugo TanigakiTakenori FujiwaraHitoshi ArakiTomoyuki HondaYu Shoji
- Optimizing Flip Chip Packaging for High Density Bump via Mold Flow Simulation with Through-HolesTzu Chieh ChienShih Kun LoZong Yuan LiChia Tso HsiehYen Hua KuoHui Chung LiuLu Ming LaiKuang Hsiung Chen
- Enhancing Signal Integrity in High-Performance Electronics through Advanced TGV Fabrication with LPKF's LIDE TechnologyRichard NoackRoman OstholtNils AnspachRafael SantosNorbert Ambrosius
- Fabrication and Passive Assembly of Broadband Evanescent Couplers for Sustainable Pbps Co-Packaged OpticsDrew WeningerSamuel SernaLuigi RannoLionel KimerlingAnuradha Agarwal
- Ultra-High Density RDL on Glass Core Substrate for Heterogenous IntegrationTakamasa TakanoSatoru KuramochiMasaya Tanaka
- Development of Virtual Material Approach for Modeling Viscoelasticity of Underfill in Flip Chip PackagesNing LiuDariush TariChristian NordhornKail ShimMatthew Tsai
- Using FEM Simulation to Predict the Mechanical and Thermal Performance of FO-EB-T PackageShane Lin LinVito LinTeny ShihAndrew KangY.P. Wang
- Characterization of Thermally-Enhanced Advanced Electronic Flip Chip CSP PackagesNahid Aslani AmoliKarthekeyan SridharSnehamay SinhaJaimal WilliamsonHiep NguyenArvin VerdeflorAyushi PradhanKathleen Timbol
- Numerical Simulation on Stress on C4 Bump Distribution of Silicon InterposerHaijie ChenZiyao BianTao LiuQiang ZhaoYaojian LinJielei Xie
- Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module PackageJacob WellsJie GengGuangyu Fan
- A Novel High Resolution Dry Film Photo-Imageable Dielectric for Redistribution Layer in Advanced Packaging ApplicationsGregory ProkopowiczYaming JiangColin HayesMichael GallagherMark ReynoldsAndrew LotzKevin WangZhou (Joe) LuChristopher Gilmore
- Enhancing Electrical Conductivity of Epoxy Resin Based Conductive Pastes Through the Use of NanoStrandTM SilverEhsan MarzbanradPeter SextonEduardo Gonzalez-Martinez
- Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam StructuresPatrick SchirmerSeverin RingelstetterKian Chong TaiMuizzuddin Azfar
- Next Generation Phase Change Material for High Power ElectronicsRita MohantyTho Quang Nguyen
- Applying Machine Learning to the Smart Welding of Cylindrical Lithium-ion Battery Cells within Battery ModulesMike McKeown
- Fine Gold and Coated-Ag Bonding Wire: Vertical Wire BondingSarangapani MuraliDhayalan MariyappanTuriano Alejandro Jr AdvinculaChong Mei Joanne HoeLim Yee Evonne WeonKang Sungsig SS
- Gas-free & Nano Al2O3-coated Ag Bonding Wire for Replacing Au WireSoojae ParkEunmin ChoSiyeong OhHongsik Kim
- Cause and Prevention of Large Void Formation in Flip Chip Solder ConnectionsJ. Ramirez RamosT. MarinisD. Hanson
- Advanced 3D Integrated Circuit Packaging: Metallurgical Improvement and FLOLA (Flux-Less Oxide-removal Laser Assembly) Process at a 9㎛-Pitch Micro-BumpSeok-Geun AhnJu-Hyeon OhGwang-Jae JeonDae-Ho LeeSun-Woo ChoiKyoung-A KimHyo-Kyeong YunJin-Young ChoiSeok-Hyun LeeSu-Jin Ahn
- Metastable Fine Grain Cu for Hybrid Bonding ApplicationsPingping YeJianwen HanStephan BrayeAbdelhamid ElSawyHarshul KhannaVeronica HayesAdam LetizeKyle WhittenThomas RichardsonElie Najjar
- Control of Cu Microstructure and Properties for Low-Temperature Direct Cu-Cu BondingCara GannettYoungmin YoonGabrielle PageDerek ThoresenBrian ParquetteMatthew GoleMatthew Van HanehemRavi Pokhrel
- Pitch Interconnection and Packaging Studies for Hybrid Electronics with Aerosol Jet Printed Particle-Free Ag InkAbdullah S. ObeidatDylan RichmondJordan Howard-JenningsAshraf UmarRiadh Al-HaidariMohammed AlhendiBehnam GarakaniDetlef-M. SmilgiesMark D. Poliks
- Ultra-Precise Dispensing in 3D Packaging: A Seamless Shift from R&D to ProductionNina SzczotkaAleksandra MotykaAleksandra ChudzyńskaMateusz ŁysieńAleksandra PerczyńskaAnna SzczurekŁukasz WitczakPiotr KowalczewskiAneta Wiatrowska
- The Effect of Conductor Processing and Properties on Additively Manufactured Antenna PerformanceEmuobosan EnakerakpoWaleed Tawfik Al-ShaibaniOlya Noruz ShamsianRiadh Al-HaidariAbdullah S. ObeidatAshraf UmarMohammed AlhendiMark Poliks
- Measurement-based Characterization and Application of Low-Loss Dielectric Materials for Development of 6G Sub-THz AntennasIvan NdipThi Huyen LeKavin Senthil MurugesanJens SchneiderLutz GerholdHabib HichriRyohei OishiReki NakanoMartin Schneider-Ramelow
- Processing Tank Flow Mechanics for Next Generation Glass Core SubstratesVladimir KudriavtsevRajeev BajajChris LaneZia Karim
- High-Performance Structures with Photo-Imageable Pastes for mmWave ApplicationsKathrin ReinhardtLynn RatajczakStefan KörnerUwe Partsch
- The Ideal Switch® with Advanced Glass PackagingAric ShoreyJeff BalounMark Walker
Wells, Jacob, Jie Geng, and Guangyu Fan. 2025. “Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module Package.” IMAPSource Proceedings 2024 (Symposium): 391–95. https://doi.org/10.4071/001c.129753.