Vol. 2024, Issue Symposium, 2024February 13, 2025 EDT
Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module Package
Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module Package
Wells, Jacob, Jie Geng, and Guangyu Fan. 2025. “Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Formic Acid Reflow for TIM1 IC Module Package.” IMAPSource Proceedings 2024 (Symposium): 391–95. https://doi.org/10.4071/001c.129753.