Vol. 2024, Issue Symposium, 2024February 10, 2025 EDT
Comparison of High-Frequency Transmission Characteristics of Transmission Lines on Copper-Plated Cycloolefin Polymer Using Directly Sputtered Copper Seed Layer and Electroless Copper Plating Seed Layer
Comparison of High-Frequency Transmission Characteristics of Transmission Lines on Copper-Plated Cycloolefin Polymer Using Directly Sputtered Copper Seed Layer and Electroless Copper Plating Seed Layer
Shimizu, Akihiro, Kazuhiro Fukada, Shinichi Endo, Mitsunori Abe, and Akiko Matsui. 2025. “Comparison of High-Frequency Transmission Characteristics of Transmission Lines on Copper-Plated Cycloolefin Polymer Using Directly Sputtered Copper Seed Layer and Electroless Copper Plating Seed Layer.” IMAPSource Proceedings 2024 (Symposium): 364–68. https://doi.org/10.4071/001c.129624.