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Symposium Proceedings
Vol. 2024, Issue Symposium, 2024February 03, 2025 EDT

Effect of Bonding Pressure on Thermal Performance of Graphene-enhanced Thermal Interface Materials for Immersion Cooling Applications

Kristoffer Harr, Yuanyuan Wang, Kurban Yasin, Jiabin Chen, Jin Chen, Johan Möller, Johan Liu,
graphenethermal interface material (TIM)immersion coolingbonding pressurethermal performanceelectronics cooling
https://doi.org/10.4071/001c.129285
IMAPSource Conference Papers
Harr, Kristoffer, Yuanyuan Wang, Kurban Yasin, Jiabin Chen, Jin Chen, Johan Möller, and Johan Liu. 2025. “Effect of Bonding Pressure on Thermal Performance of Graphene-Enhanced Thermal Interface Materials for Immersion Cooling Applications.” IMAPSource Proceedings 2024 (Symposium): 455–60. https:/​/​doi.org/​10.4071/​001c.129285.
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