ISSN 2380-4505
Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Flex-DIMM – A New High Density Module Form Factor
Flex-DIMM – A New High Density Module Form Factor
Articles in Vol. 2015, Issue 1, 2015
Vol. 2015, Issue 1, 2015
- Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachmentJohn McConnellJ. BultitudeJ. QaziJ. MageeC. ShearerK. Holcomb
- Hi Density QFN Packages and Modules Incorporating Windings for Inductors, Chokes and AntennaeCVInc
- Hermetic Seal Bonding at Low-temperature with Sub-micron Gold Particles for Wafer Level PackagingToshinori OgashiwaKentaro TotsuMitsutomo NishizawaHiroyuki IshidaYuya SasakiMasayuki MiyairiHiroshi MuraiYukio KanehiraShuji TanakaMasayoshi Esashi
- The Glass Core with an Anti-crack Propagation StructureSukhyeon ChoYongho BaekYoong OhDahee KimHyungki Lee
- Packaging Tradeoff for SIP Integration Targeting High Speed PAM-4 ApplicationsB HaentjensG DesruellesG ChrétienA LeborgneY HaentjensJ DupuyF JorgeA KonczykowskaI BeauvisageR DellemeD MartinS BilaK FriguiS NgohoB FriguiH Mardoyan
- Wafer Level 3D System Integration using a Novel 3D-RDL TechnologyAyad GhannamAlessandro MagnaniDavid BourrierThierry Parra
- A Curvature-Based Interpretation of the Steinberg Criterion for Fatigue Life of Electronic ComponentsMichael G. Béda
- Ceramic decals – predesigned thick-film sensors for variable surfacesThomas SeutheMarkus EbersteinRolf PetersenHans-Jürgen Amann
- Viewing Context Adaptive On-Chip Video MemoryDongliang ChenJinhui WangNa Gong
- Solder Paste Corrosivity Assesment: Bono TestCéline PuechagutAnne-Marie LaügtEmmanuelle GuénéRichard Anisko
- Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy ChainsJ. GaudestadA. OrozcoI. De WolfT. WangT. WebersR. KelleyT. MorrisonS. Madala
- A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series DiodeAdam MorganAnkan DeHaotao KeXin ZhaoKasunaidu VechalapuDouglas C. HopkinsSubhashish Bhattacharya
- Engineered Nanocomposites for Additive Manufacturing of Microwave ElectronicsJuan CastroEduardo RojasThomas WellerJing Wang
- Technique to predict reliability failure in side-gate transfer molded packagesNishant LakheraTom BattleSheila ChopinSandeep ShantaramAkhilesh K. Singh
- Isolation Resistance of Encapsulated Electrical Conductors and Terminations for Biomedical ApplicationsThomas F. MarinisJoseph W. Soucy
- Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment ApplicationsZhenzhen ShenAleksey ReidermanCasey Anude
- Leveraging Glass Properties for Advanced PackagingA.B. ShoreyY.J. LuG.A. Smith
- Thermally Conductive Plastics for Enhanced Thermal ManagementChandrashekar Raman
- Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substratesMarek GorywodaRainer DohleBernd KandlerBernd Burger
- Reliability Performance of Palladium Coated Copper Wire in High Temperature Bake at Extreme DurationsTu Anh TranChu-Chung (Stephen) LeeVarughese Mathew
- Fan-in WLP: Technology and Market TrendsA. IvankovicT. BuissonS. KumarA. PizzagalliJ. AzemarR. Beica
- Heterogeneous Integration of a 300mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-last 3D InterconnectionColin McDonoughDoug La TulipeDan PascualPaul TarielloJohn MucciMatt SmalleyAnh NguyenTuan VoCorbet JohnsonPhung NguyenJeremiah HebdingGerald LeakeMichele MorescoErman TimurdoganVladimir StojanovićMichael R. WattsDouglas Coolbaugh
- Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and CyclingChaobo ShenCong ZhaoZhou HaiJiawei ZhangM. J. BozackJ. C. SuhlingJohn L. Evans
- TCT Reliability of Organic Passivation Layer for WLCSPMitsuru FujitaAtsushi FujiiShuji ShimodaYoshiharu Kariya
- High Reliability No-Clean Solder Paste for Designs where Flux Cannot be DriedFen ChenNing-Cheng Lee
- Predicting Package Level Failure Modes in Multi Layered PackagesGil SharonGreg CaswellNathan Blattau
- Metal Salt Solution-Nanoprecipitation Method for Improvement in Reliability of Sintered Ag Nanoparticle BondingDaisuke HiratsukaAkihiro SasakiTomohiro IguchiTetsuya YamamotoTsuyoshi Sato
- Critical Barriers Associated with Copper WireWilliam G. Crockett
- A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposerZhiming LiuSara HunegnawHailuo FuJun WangTafadzwa MagayaMichael MerschkyTobias BernhardAric ShoreyHobie Yun
- A TXV-less Packaging Platform for the Era of IoTsDyi-Chung HuYu-Min LinHsiang Hung ChangTao-Chih ChangWei-Chung LoChih-Kung YangHenry YangYin-Po HungYu-Hua ChenRa-Min Tain
- Advanced Chemical Processes for Semi-additive PWB fabrication for Fine Line Formation Targeting Line and Space=5μm/5μmSatoshi KawashimaKazutaka Tajima
- Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density ApplicationsAlvin LeeJay SuXiao LiuYin-Po HungYu-Min LinShin-Yi HuangRen-Shin ChengTao-Chih Chang
- Flex-DIMM – A New High Density Module Form FactorJames E. Clayton
- Additive Manufacturing Design and Fabrication of Ceramic Cylindrical Ion Trap Mass Analyzer Chips for Miniaturized Mass Spectrometer Smart-DevicesPatrick RomanXudong ChenW. Kinzy JonesAli KarbasiC. Mike NewtonTravis BatesJacob DenkinsShekhar Bhansali
- Multiphysics Modeling of Underfill Flow and Cure during Thermocompression BondingMark OliverNagi Elabbasi
- Failure Analyses of Modern Power Semiconductor Switching DevicesNathan ValentineDiganta DasBhanu SoodMichael Pecht
- Hermetically Sealed Glass PackagesRoupen KeusseyanTim Mobley
- Analysis of 16 QFN Device I/O Pads for Solderability FailuresRama HegdeAnne AndersonSam SubramanianAndrew MawerEd HallVK LeongA. Selvakumar
- Multi Beam Full Cut Dicing of Thin Si IC wafersJeroen van BorkuloRichard van der StamWon Chul JungPaul Verburg
- The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market TrendsR. BeicaA. IvankovicT. BuissonS. KumarJ. Azemar
- PERSPECTIVE ON REQUIRED PACKAGING TECHNOLOGIES FOR NEUROMORPHIC DEVICESYasumitsu OriiAkihiro HoribeKuniaki SueokaKeiji MatsumotoToyohiro AokiHirokazu NomaSayuri KoharaKeishi OkamotoShintaro YamamichiKohji HosokawaHiroyuki Mori
- System on film type substrates: processes, structure and real modulesChih Kuang Yang
- Broadband 1-to-N Circuit Combiner for mm-wave ApplicationsAli M. DarwishH. Alfred HungJoe QiuAmr IbraheemEdward Viveiros
- Mechanical testing and fracture analyses of miniaturized ZnO-based multilayer componentsK. MacurovaM. GruberM. PletzP. SupancicR. DanzerF. AldrianR. Bermejo
- Modeling, Design, Fabrication, and Characterization of Ultra-high Bandwidth 3D Glass Photonic SubstratesBruce ChouWilliam VisRyuta FuruyaVenky SundaramTummala Rao
- A Case Study of Ultra-Leach Resistant Thick Film Conductors for Non-Magnetic ApplicationsJohn J. B. Silvia
- Line coding methods for high speed serial linksAbdelaziz GoulahsenJulien SaadéFrédéric Pétrot
- Ensuring Suitability of Cu Wire Bonded ICs for Automotive ApplicationsJames McLeishRandy Schueller
- Embedded passives on low profile Silicon substrate technology for Medical implants, Wearables and Internet of ThingsSébastien LeruezCatherine Bunel
- The Benefits of Flux-Coated Solder Preforms in a QFN Assembly ProcessBrandon JuddMaria Durham
- Low Inductance Antenna (LIA) plasma source and plasma-enhanced dual rotatable magnetron sputter assisted with LIAY. TakayaY. TaniokaH. YoshinoA. Osawa
- Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die TiltRandy HammKen Peterson
- Print Copper on Ceramic for High Reliability ElectronicsRyan PersonsPaul Gundel
- Reliability of Manganese Dioxide and Conductive Polymer Tantalum Capacitors under Temperature Humidity Bias TestingAnto PeterMichael H. AzarianMichael Pecht
- Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die PlacementDaniel DuffyHemal BhavsarLin XinJean LiuBruno Tolla
- Two step silicon microfluidics for capillary valve applicationsBivragh MajeedAhmed TaherBen JonesDeniz Sabuncuoglu
- High Density Interposer – Challenges and OpportunitiesMathias BoettcherFrank WindrichM-J. Wolf
- Challenge to zero CTE and lower shrinkage organic substrate material for thin CSP packageShintaro HashimotoShin TakanezawaShinji TsuchikawaMasaaki TakekoshiKenichi OohashiKoji Morita
- Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densitiesTakuya KadoguchiKimihiro YamanakaShijo NagaoKatsuaki Suganuma
- Shrinkage controlled pastes for bulky silver and copper thick films in power electronicsRichard SchmidtKathrin ReinhardtThomas SeutheOlga SchwabClaudia FellerMarkus Eberstein
- Understanding the Role of Ultrasonic Welding in Wire BondingLee Levine
- Main Impact Factors on Internal Stress of Electroless Deposited Copper FilmsTobias BernhardSebastian ZarwellFrank BrüningRalf BrüningTanu Sharma
- Heterogeneous integration of a miniaturized W-band radar moduleK.-F. BeckerL. GeorgiR. KahleS. VogesF. BrandenburgerJ. HöferC. EhrhardtC. ZechB. BaumannA. HuelsmannA. GrasenackS. ReinoldB. KleinerT. BraunM. Schneider-RamelowK.-D. Lang
- Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature PackagingXiangdong LiuHiroshi Nishikawa
- FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE ModulesSteffen KroehnertJosé CamposAndré CardosoEoin O'TooleAbel JaneiroNuno Vieira
- Pure Chemical Reduction of Tin Oxides to Metallic Tin by Atmospheric Plasma to Improve Interconnection Reflow of Pb-free SoldersKang-Wook LeeKatsuyuki SakumaThomas LombardiJason RowlandDavid LewisonEric Schulte
- 2.5D Interposers and Advanced Organic Substrates Landscape: Technology and Market TrendsA. IvankovicT. BuissonS. KumarA. PizzagalliJ. AzemarR. Beica
- Embedded Flexible Hybrid Electronics for the Internet of ThingsVal R. Marinov
- Impact of Metallurgical and Mechanical Properties of Sintered Silver Nanoparticles on Die-attach Reliability of High-temperature Power ModulesHiroaki TatsumiSho KumadaAtsushi FukudaHiroshi YamaguchiYoshihiro Kashiba
- A New Package for High Speed and High Density eStorage Using the Frequency Boosting ChipGeukchan KimHyejin KimSunghoon Chun
- Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature ApplicationsCatherine ShearerKen Holcomb
- Tunable High-Q TSV Inductor Packaging with MEMSBruce KimSaikat MondalSang-Bock Cho
- Improvement of High Power Cycling Reliability having Sn-Cu Based SolderMiyazaki TakaakiIkeda Osamu
- Advanced lithography and electroplating approach to form high-aspect ratio copper pillarsKeith BestRoger McClearyRichard HollmanPhillip Holmes
- Dual-frequency MEMS based Oscillator using a single ZnO-on-SOI ResonatorDi LanJulio DewdneyI-Tsang WuIvan RiveraAdrian AvilaJing Wang
- Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materialsVarughese MathewSheila Chopin
- L/S ≤ 5/5μm Line Embedded Organic Substrate Manufacturing for 2.1D/2.5D SiP ApplicationYu-Hua ChenShyh-Lian ChengDyi-Chung HuTzvy-Jang Tseng
- A New In-line Laser-based Acoustic Technique for Pillar Bump MetrologyTodd W. MurrayAndrew BakirDavid M. StobbeMichael J. KotelyanskiiRobin A. MairManjusha MehendaleXueping RuJonathan D. CohenMichelle T. SchulbergPriya MukundhanTimothy J. Kryman
- Smart PCBs for Smart Appliances - Embedding as IoT EnablerNick Renaud-BezotChristian GallerChristian Vockenberger
- Finite Element Analysis and Measurement of Low-Profile BVATMPackage On Package (PoP) Warpage CharacteristicsAkash AgrawalAshok Prabhu
- High Tolerance, Micron Scale, Inline Embedded Resistors using Thin Film Additive ManufacturingS. LauerV.D. HeydemannJ. SlaterJ. Mazurowski
- The Future of Solder Joint EncapsulantMary LiuWusheng Yin
- Development of thin package using the glass carrier substrateJun OnoharaTakashi FujitaYoshito Akutagawa
- Improved properties and reduced metal content conductive powders for high temperature sensor applicationsRichard StephensonHoward Imhof
- High Speed, High Density Separable Interconnect - 1000 plus I/O ultra-low profile interfacesJames Rathburn
- Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al MetallizationDi Erick XuJimy GomesMichael MayerRob LynJohn Persic
- Improving mean time to develop micro-bump/pillar fabrication process for vertical interconnections by combined defectivity and metrology approachNicolas DevanciardFranck BanaNicolas BressonStéphane ReyCarlos BeitiaDario AlliataDarcy HartJohn ThornellJustin Miller
- Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) PackagesWon Kyoung ChoiDuk Ju NaKyaw Oo AungAndy YongJaesik LeeUrmi RayRiko RadojcicBernard AdamsSeung Wook Yoon
- Embedded solutions: Fan-out and Embedded Die Packages market and technology trendsJérôme Azémar
- Hermetic package for optical devices using room temperature welding technology and transparent lid, for space applicationsH. LundénL. MurphyA. MäättänenT. Kumpulainen
- Enhanced Mpilog macromodels for Signal and Power Integrity SimulationsGianni SignoriniClaudio SivieroIgor Simone StievanoStefano Grivet-Talocia
- 2.5D Smart Objects Using Thermoplastic Stretchable InterconnectsBart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren
- Characterization of a New and Complete Lead-Free Thick Film Resistor System for the Hybrid Circuit MarketMichael A. SkurskiMarc H. LaBranche
- RF and Microwave Power Amplifiers assembly – Interaction between materials, design and process on reliabilityTennyson NgutyTyrone PlataHenk Thoonen
- Design challenges in Interposer based 3-D Memory Logic InterfaceAndy HeinigMuhammad Waqas ChaudharyRobert FischbachMichael Dittrich
- Digital Manufacturing for Electrically Functional Satlet StructuresPaul I. DeffenbaughMike NewtonKenneth H. Church
- Towards 200mm 3D RF interposer technologyPhilippe SoussanKristof VaesenBart VereeckeJian Zhu
- A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALSSwapan K. BhattacharyaFei XieHan WuKelley HodgeKeck PathammavongPaul N. HoustonDaniel F. BaldwinAlbert Giorgini
- Quantitative Projections of the Cost Benefits of 3D IntegrationAdam BeeceDragomir MilojevicGeert van der PlasRod AugurMichelle SureddinJagar SinghBiswanath SenapatiGuillaume BoucheRamakanth AlapatiJason StephensIrene LinMahbub RashedLu YuanJongwook KyeYoungtag WooAli WehbiPeter HangVan Ton-ThatVijay KanagalaDonald YuShan GaoSrikant Samavedam
- Cleaning in Electronics: Understanding Today's NeedsP.J. DuchiAnne-Marie LaügtLaurent Levasseur
- I/O Printed Circuit Board Assemblies; Recent Learning in Mechanical Stress Analysis, Verification Testing, and Post-test Analysis Techniques and ResultsJohn TorokShawn CanfieldSuraush KhambatiRobert MulladyBudy NotohardjonoJing Zhang
- Formulation Development for Bosch Etch Residue Removal: Effect of Solvent on Removal EfficiencyRichard PetersYuanmei CaoKim PollardDon PfettscherMike Phenis
- Thermal Management Solutions for enhanced Digital Flight Data Acquisition Unit in Avionics ApplicationsVicentiu GrosuChris LindgrenTamas Vejsz
- Highly conductive MWNT/silicone composite with low density MWNT bundlesSangeui LeeShinje ChoHajin KimIntaek HanYoonchul Sohn
- Advanced Manufacturing Technology for Fan-Out Wafer Level PackagingDoug Shelton
- Simulation Methodology and Design Flow for Decoupling Optimization in Case of Design ReusingBenoit GoralCyrille GautierAlexandre Amédéo
- Optimal SMT Electronics Assembly Guidelines for Stencil PrintingEd Briggs
- Porosity Evolution of Ag-Sintering at Die AttachSihai ChenGuangyu FanXue YanChris LabarberaLee KresgeNing-Cheng Lee
- Chip Last Fan Out as an Alternative to Chip FirstScott ChenSimon WangColtrane LeeAdren HsiehJohn HuntWilliam Chen
- Sol-gel doped-PZT thin films for integrated tunable capacitorsWarda BenhadjalaGwenael Le RhunChristel DieppedaleFlorence SonneratJennifer GuillaumeClémence BonnardPhilippe RenauxHenri SibuetChristophe BillardPascal GardesPatrick Poveda
- Large Scale Photodesmear for Via Residue Cleaning in High Density Interconnect substratesTomoyuki HabuMasahito NamaiAkira AibaHajime KikuiriShun MaruyamaHiroki HoribeHiroko SuzukiShinichi EndoToru FujinamiShintaro YabuRahul JainKristof DarmawikartaMichael Obrien
- Interposers: A Central Generic Technology for IoTA. RouzaudG. Pares
- Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical CharacterizationCelso CavacoLan PengKoen De LeersnijderStefano GuerrieriDeniz S. TezcanHaris Osman
- High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based MoldingShijo NagaoTakuo SugiokaSatoshi OgawaTeruhisa FujibayashiZhang HaoKatsuaki Suganuma
- Cost Analysis of Flip Chip Assembly Processes: Mass Reflow with Capillary Underfill and Thermocompression Bonding with Nonconductive PasteAmy Palesko
- Finite element analysis of lidded flip-chip packages: A study on the impact of thermal interface material compressibility and stress-free conditions on modeling predictionsTuhin Sinha
- Aerosol Jet® Enabled 3D Antenna and Sensors for IoT ApplicationsMichael O'ReillyMichael J. RennDavid Sessoms
- Real-Time Observation of Interface Relative Motion during Ultrasonic Wedge-Wedge Bonding ProcessYangyang LongJens TwiefelJoscha RothJörg Wallaschek
- Improving Stitch Bond on Hybrid Thick Film Substrate using Stand-Off Stitch Wire Bond TechniqueRichard C. Garcia
- Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass InterposersBrett SawyerYuya SuzukiZihan WuHao LuVenky SundaramKadappan PanayappanRao Tummala
- Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C ApplicationsFang YuR. Wayne JohnsonMichael C. Hamilton
- High-Voltage Stacked Diode PackageLauren BotelerAlexandra RodriguezMiguel HinojosaDamian Urciuoli
- Optimizing Diamond Heat Spreaders for Thermal Management of Hotspots for GaN DevicesThomas ObeloerBruce BolligerYong HanBoon Long LauGongyue TangXiaowu Zhang
- Wedge Bond Process Optimization Method for 1.5 mil Al Wire on Al Bond PadWenjuan QiDaniel D. Evans
- Through Glass Via (TGV) Technology for RF ApplicationsA. B. ShoreyS. KuramochiC. H. Yun
- A Gallium Nitride-Based Power Module for Totem-Pole Bridgeless Power Factor Correction RectifierWenli ZhangZhengyang LiuFred LeeShuojie SheXiucheng HuangQiang Li
- Copper wire bonding ready for industrial mass productionM. BrökelmannD. SiepeM. HunstigM. McKeownK. Oftebro
- Barrier Properties of Electroless Ni-B UBM for Solder JoiningMasaru MoritaToshiya AkamatsuNobuhiro ImaizumiSeiki Sakuyama
- Substrate Temporary Bonding Supporting Post-Processing ApplicationsJared PettitAlman LawAlex BrewerJohn Moore
- Phase Change Material for Thermal Management in 3D Integrated Circuits PackagingMingli LiNa GongJinhui WangZhibin Lin
- High Performance High Density Interconnects using Liquid Crystal Polymer-Substrates, Circuits Driven by Mobile ApplicationsJames Rathburn
- C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 ProductsE. MisraT. WassickI. MelvilleK. TungaD. QuestadC. MuzzyJ. CoffinC. CareyR. Mendelson
- Moldflow simulation of an exposed pad leaded packageVibhash JhaTorsten Hauck
- Types of Solder Preforms and Difficult GeometriesHerbert LudowiegAdam Murling
- Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic StimulationCaroline K. BjuneThomas F. MarinisTirunelveli S. SriramJeanne M. BradyJames MoranPhilip D. ParksAlik S. WidgeDarin D. DoughertyEmad N. Eskandar
- Implication of Multiple Leak Tests and Impact of Rest Time on Avionic HybridsMaureen PerrySteve Smalley
- Expanded Beam Fiber Optic Connectors Increase Optical Link MarginJohn Mazurowski
- Advances in Wire Bonding Technology for Different Bonding Wire MaterialIvy QinAashish ShahHui XuBob ChylakNelson Wong
- Control of 3D IC process steps by optical metrologiesG. FresquetD. Le CunffTh. RaymondD. K. de Vries
- A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power InterconnectionsJennifer StabachZach ColeChad B. O'NealBrice McPhersonRobert ShawBrandon Passmore
- Bonding Technologies for 3D integrationSascha LohseAlexander Wollanke
- Reliability of silver wedge bonding for power devicesXing WeiZhou YuWanmeng XuTomonori IizukaKohei Tatsumi
- BCB-Based Dry Film low k Permanent Polymer with sub 4-μm Vias for Advanced WLP and FO-WLP ApplicationsMichael ToepperTanja BraunRobert GernhardtMartin WilkePiotr MackowiakKlaus-Dieter LangCorey O'ConnorRobert BarrTina AoudeJeffrey CalvertMichael GallagherJong-Uk KimAndrew PolitisEllisei Iagodkine
- Enhanced optical performance for a reduction stepper to meet the challenges for advanced packaging applicationsJames E. WebbPhilippe Cochet
- Evaluation about Solder-IMC Crack of Fine Pitch BGA PackageTaeho KangAra LeeJaewoo JeongDongok Kwak
- Current Developments in Precious Metal Plating for the Semi - Conductor/Micro - Electronics MarketsSteven BurlingGary NichollsStewart HemsleySadayuki NagatomoKazuhiko Shiokawa
- A Novel Back-side Via Process For Low-cost TSV.Toshiyuki SakuishiTakahide MurayamaYasuhiro Morikawa
- Development and usability study of pre-applied inter chip fill for 3D-ICKan TakeshitaMakoto IkemotoMasaya SugiyamaHidehiro YamamotoHideki KiritaniYashuhiro Kawase
- A Direct Digital Manufactured RFID System Applied to Teaching Antenna Theory to Pre-College StudentsEduardo A. Rojas-NastrucciRamiro A. RamirezSean T. MurphyMike NewtonThomas M. Weller
- HIGH DATA RATE SILICON PHOTONIC - CMOS ELECTRONIC MODULES USING COPPER MICROBUMPSS. BernabéG. ParesB. BlampeyK. RidaO. CastanyS. MenezoS. MalhouitreC. KoppK. DiengE. Temporiti
- A Low-Impedance Projection Welding Device for Large Package Hermetic SealingThomas E. Salzer
Clayton, James E. 2015. “Flex-DIMM – A New High Density Module Form Factor.” IMAPSource Proceedings 2015 (1): 806–9. https://doi.org/10.4071/isom-2015-THP31.