ISSN 2380-4505
Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachment
Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachment
McConnell, John, J. Bultitude, J. Qazi, J. Magee, C. Shearer, and K. Holcomb. 2015. “Application of Transient Liquid Phase Sintering (TLPS) Interconnect Material for High Temperature Pb-Free RoHS Compliant MLCC Lead Attachment.” IMAPSource Proceedings 2015 (1): 459–64. https://doi.org/10.4071/isom-2015-WP45.