Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:53997/feed
Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 Products

E. Misra, T. Wassick, I. Melville, K. Tunga, D. Questad, C. Muzzy, J. Coffin, C. Carey, R. Mendelson,
Chip Package InteractionsC4 ElectromigrationFar Back End of Line Process and Design EnhancementsLead-free Solder Bumps
https://doi.org/10.4071/isom-2015-THP21
IMAPSource Conference Papers
Misra, E., T. Wassick, I. Melville, K. Tunga, D. Questad, C. Muzzy, J. Coffin, C. Carey, and R. Mendelson. 2015. “C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-Free C4 Products.” IMAPSource Proceedings 2015 (1): 787–92. https:/​/​doi.org/​10.4071/​isom-2015-THP21.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system