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ISSN 2380-4505
Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications

Catherine Shearer, Ken Holcomb,
Transient liquid phase sinteringsolder replacementhigh operating temperature interconnect
https://doi.org/10.4071/isom-2015-WP44
IMAPSource Conference Papers
Shearer, Catherine, and Ken Holcomb. 2015. “Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications.” IMAPSource Proceedings 2015 (1): 453–58. https:/​/​doi.org/​10.4071/​isom-2015-WP44.

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