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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Impact of Metallurgical and Mechanical Properties of Sintered Silver Nanoparticles on Die-attach Reliability of High-temperature Power Modules

Hiroaki Tatsumi, Sho Kumada, Atsushi Fukuda, Hiroshi Yamaguchi, Yoshihiro Kashiba,
Bonding reliabilitymechanical propertiesnanocrystalline metalspower modulesilver nanoparticles
https://doi.org/10.4071/isom-2015-THP42
IMAPSource Conference Papers
Tatsumi, Hiroaki, Sho Kumada, Atsushi Fukuda, Hiroshi Yamaguchi, and Yoshihiro Kashiba. 2015. “Impact of Metallurgical and Mechanical Properties of Sintered Silver Nanoparticles on Die-Attach Reliability of High-Temperature Power Modules.” IMAPSource Proceedings 2015 (1): 842–47. https:/​/​doi.org/​10.4071/​isom-2015-THP42.
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