ISSN 2380-4505
Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Pure Chemical Reduction of Tin Oxides to Metallic Tin by Atmospheric Plasma to Improve Interconnection Reflow of Pb-free Solders
Pure Chemical Reduction of Tin Oxides to Metallic Tin by Atmospheric Plasma to Improve Interconnection Reflow of Pb-free Solders
Lee, Kang-Wook, Katsuyuki Sakuma, Thomas Lombardi, Jason Rowland, David Lewison, and Eric Schulte. 2015. “Pure Chemical Reduction of Tin Oxides to Metallic Tin by Atmospheric Plasma to Improve Interconnection Reflow of Pb-Free Solders.” IMAPSource Proceedings 2015 (1): 725–29. https://doi.org/10.4071/isom-2015-Poster2.