ISSN 2380-4505
Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging
Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging
Li, Mingli, Na Gong, Jinhui Wang, and Zhibin Lin. 2015. “Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging.” IMAPSource Proceedings 2015 (1): 649–53. https://doi.org/10.4071/isom-2015-THA44.