An Overview - Temporary Wafer Bonding / Debonding for 2.5D and 3D Technologies

Rajen Chanchani

doi:10.4071/isom-2012-TA16

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Chanchani, Rajen. 2012. “An Overview - Temporary Wafer Bonding / Debonding for 2.5D and 3D Technologies.” IMAPSource Proceedings 2012 (1): 1–9. https://doi.org/10.4071/isom-2012-TA16.

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