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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Packaging of High Power UV-LED Modules on Ceramic and Aluminum Substrates

Marc Schneider, Benjamin Leyrer, Christian Herbold, Stefan Maikowske,
UV-LEDhigh power densityalumina substratealuminum substratewater cooling
https://doi.org/10.4071/isom-2012-TA66
IMAPSource Conference Papers
Schneider, Marc, Benjamin Leyrer, Christian Herbold, and Stefan Maikowske. 2012. “Packaging of High Power UV-LED Modules on Ceramic and Aluminum Substrates.” IMAPSource Proceedings 2012 (1): 225–32. https:/​/​doi.org/​10.4071/​isom-2012-TA66.
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