ISSN 2380-4505
Horibe, Akihiro, Sayuri Kohara, Kuniaki Sueoka, Keiji Matsumoto, Yasumitsu Orii, and Fumiaki Yamada. 2012. “Thermomechanical Design for Fine Pitch 3D-IC Packages.” IMAPSource Proceedings 2012 (1): 1001–9. https://doi.org/10.4071/isom-2012-WP66.