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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Propagation Delay Analysis in 3D Stacked Memory using Novel MOS Depletion Layer Modeling Approach for Through Silicon Via

Kaushal Kannan, Sarma G. Harihara, Sukeshwar Kannan,
Three-Dimension (3D)Through Silicon Via (TSV)Memory
https://doi.org/10.4071/isom-2012-TP25
IMAPSource Conference Papers
Kannan, Kaushal, Sarma G. Harihara, and Sukeshwar Kannan. 2012. “Propagation Delay Analysis in 3D Stacked Memory Using Novel MOS Depletion Layer Modeling Approach for Through Silicon Via.” IMAPSource Proceedings 2012 (1): 318–25. https:/​/​doi.org/​10.4071/​isom-2012-TP25.
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