Vol. 2012, Issue 1, 2012January 01, 2012 EDT
New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages
New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages
Tateishi, Yohei, Makoto Fujimura, Takashi Iga, and Toshihiko Jimbo. 2012. “New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages.” IMAPSource Proceedings 2012 (1): 991–97. https://doi.org/10.4071/isom-2012-WP64.