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ISSN 2380-4505
Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages

Yohei Tateishi, Makoto Fujimura, Takashi Iga, Toshihiko Jimbo,
Build-up InsulationCyclo-Olefin PolymerHigh-Performance IC PackagesCTElow transmission loss
https://doi.org/10.4071/isom-2012-WP64
IMAPSource Conference Papers
Tateishi, Yohei, Makoto Fujimura, Takashi Iga, and Toshihiko Jimbo. 2012. “New Build-up Insulation Material Based on Cyclo-Olefin Polymer for High-Performance IC Packages.” IMAPSource Proceedings 2012 (1): 991–97. https:/​/​doi.org/​10.4071/​isom-2012-WP64.

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