ISSN 2380-4505
Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Effect of preformed IMC Layer on Electromigration of Solder Capped Cu Pillar Bump Interconnection on an organic substrate
Effect of preformed IMC Layer on Electromigration of Solder Capped Cu Pillar Bump Interconnection on an organic substrate
Orii, Yasumitsu, Kazushige Toriyama, Sayuri Kohara, Hirokazu Noma, Keishi Okamoto, and Keisuke Uenishi. 2012. “Effect of Preformed IMC Layer on Electromigration of Solder Capped Cu Pillar Bump Interconnection on an Organic Substrate.” IMAPSource Proceedings 2012 (1): 455–63. https://doi.org/10.4071/isom-2012-TP61.