ISSN 2380-4505
Chae, MyoungSu, Eric Ouyang, JaeHan Chung, DokOk Yu, SeonMo Gu, Gwang Kim, and Billy Ahn. 2012. “Simulation and Experiment of Molded Underfill Voids.” IMAPSource Proceedings 2012 (1): 359–65. https://doi.org/10.4071/isom-2012-TP33.
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