ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY

G. Parès; F. Schnegg; A. Attard; D. Cruau; F. De Crecy; A. N'hari; R. Anciant; G. Klug; H. Luesebrink; K. Martinschitz; C. Karoui; G. Simon

doi:10.4071/isom-2012-WA61

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Parès, G., F. Schnegg, A. Attard, D. Cruau, F. De Crecy, A. N’hari, R. Anciant, et al. 2012. “ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY.” IMAPSource Proceedings 2012 (1): 710–19. https://doi.org/10.4071/isom-2012-WA61.

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