Vol. 2012, Issue 1, 2012January 01, 2012 EDT
ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY
ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY
Parès, G., F. Schnegg, A. Attard, D. Cruau, F. De Crecy, A. N’hari, R. Anciant, et al. 2012. “ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY.” IMAPSource Proceedings 2012 (1): 710–19. https://doi.org/10.4071/isom-2012-WA61.