ISSN 2380-4505
Articles in Vol. 2010, Issue 1, 2010
Vol. 2010, Issue 1, 2010
- Wafer-Level hermetic packaging for bio-medical applicationsAntonio La MannaCarine GeretsMaaike Op de BeeckThibault BuissonEric DyPhilippe Soussan
- Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip ChipDo-Jae YooKi-Chan KimYoung-Hoon KwakMin-Seok JangJob HaJae-Cheon DohChang-Bae LeeYoung-Do Kweon
- Pinout Optimization for 10 Gbps+ Serial Link RoutingDavid SiadatJudy Priest
- The reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module ApplicationChang-Bae LeeJin-Gu KimYoung-Do KweonKyoung-Moo HarrYoung-Ho Kim
- Counterfeit Detection Strategies: When to Do It / How to Do ItGreg Caswell
- Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS TechnologyZhongping BaoJames Burrell
- Wafer Level Package with Y shaped TSV and Vacuum Sealing by Cu-Sn Isothermal Solidification for MEMS ResonatorYuhan CaoLe Luo
- The Role of Wafer Bonding in 3D Integration and PackagingJames HermanowskiGreg George
- Compression Molding for Thin PoP Top PackagesRavikumar AdimulaJason BrandMyung Jin YimJames ZhangRichard StrodeChan Yoo
- Development on Silicon module with Cu-filled TSV and Integrated Passive DevicesYun-Mook ParkJun-Kyu LeeByung-Jin ParkByeung-Gee KimJung-Won LeeIn-Soo Kang
- Fine Pitch 3D Dispensable Electrical Interconnects for System In Package SolutionsJeff S. LealSuzette K. PangrleCharles WhyteKeith BarrieJeff LeffScott McGrathGerardo Ayala
- Evaluation of Glass Frits for Development of Lead-Free Thick Film ResistorXudong ChenW. Kinzy Jones
- Evaluation of PulseForge Tool for Processing Metallic Conductive Inks on Low Temperature Substrates Part II: Screen InksS. FarnsworthI. RawsonK. A. SchroderD. Pope
- Fast and Accurate Multi-Layer PDN Analysis for Power Integrity and EMCBruce ArchambeaultKetan ShringarpureJun FanSam Connor
- Fine Pitch Cu Wire Bonding – As Good As GoldBernd K. AppeltWilliam T. ChenAndy TsengYi-Shao Lai
- Thermosonic Gold to Gold Intermetallic Advantages for CSP PackagingPhilip Couts
- Advances in Wafer Level Processing and Integration for CIS Module ManufacturingBioh KimThorsten MatthiasGerald KreindlViorel DragoiMarkus WimplingerPaul Lindner
- Imminent Needs in Future Development of Air Cooled Microprocessors Heat SinksV. GanescuA. Pascu
- Sensor Packaging: New Challenges for New ApplicationsCaroline Beelen-HendrikxCoen Tak
- Enabling MSL-1 Capability for QFN and Other Design Leadframe PackagesDan HartJohn GanjeiNilesh Kapadia
- A study of high Cu behavior on electrolytic Ni and electroless Ni pad finishHyun-Kyu LeeYong-Chul ChuMyung-Ho ChunSang-Ho Jeon
- Reliability Studies in Advanced Halogen-free Organic Laminates for Ultra-fine Pitch 3D PackagingKoushik RamachandranFuhan LiuNitesh KumbhatBaik-Woo LeeVenky SundaramRao TummalaMark Wilson
- Custom Test Fixture Design and Measurement Correlation of Differential Pairs in a Flip-Chip Organic Buildup Package Using Measurement Based De-embeddingDaniel LambalotSanjeev Gupta
- Capacitance Calculation for Offset Via Structures Using an Integral Approximation Approach Based on Finite Element MethodHanfeng WangYaojiang ZhangJames L. DrewniakJun FanBruce Archambeault
- Challenges of Wire Bonding In High Value and High Performance Medical DevicesJames A. Ohneck
- Pb-free v/s Tin-Lead Reliability Comparison for Telecom/High Reliability ApplicationsGanesh IyerGnyaneshwar RamakrishnaLavanya GopalakrishnanKuo-Chuan Liu
- Spin Coating of Dielectrics on Thin Silicon To Enhance Strength CharacteristicsFred HaringSyed Sajid AhmadNathan SchneckKaycie GerstnerNicole DallmanChris HoffarthAaron Reinholz
- Pure Palladium and Palladium Phosphorus Depositions Used in ENEPIG and ENEP Surface Finishes – Comparison of Physical Properties and Their Influence on Soldering and Au Wire BondingMustafa OezkoekHugh RobertsJoe McGurran
- Characterization of Substrate Materials For End-Use Environment ClassificationSyed Sajid AhmadArun ShankaranFred HaringJustin VignesBernd ScholzAaron Reinholz
- Dynamic Mechanical Analysis of Printed Circuit Board LaminatesJ. Kuczynski
- 3D IC Technology: the Perfect StormPhilip Garrou
- Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition ProcessBernd ScholzWeiYang LimFerdous SarwarSyed Sajid AhmadAaron Reinholz
- Processing aspects to achieve high-end hybrid backside illuminated imagersJoeri De VosKoen De MunckMehmet Akif ErismisPadmakumar Ramachandra RaoKiki MinoglouWenqi ZhangDeniz S. TezcanPiet De MoorPhilippe Soussan
- Tape-Peel Testing as a Simple Method to Evaluate the Adhesion of Coated Layers on Metal Core PCBBernd ScholzIsmir PekmicSyed Sajid AhmadAaron Reinholz
- On the Origins, Status, and Future of Flip Chip & Wafer Level PackagingAlan HuffmanPhilip Garrou
- High Frequency Measurement Techniques for On-Chip InductorsBruce C. KimDae-Hyun HanSeok-Ho Noh
- Effects of crystallographic orientation of Sn on electromigration behaviorKiju LeeKeun-Soo KimKimihiro YamanakaYutaka TsukadaSoichi KuritaniMinoru UeshimaKatsuaki Suganuma
- Characteristic Life Based Acceleration Transforms for Lead-Free Solder Joint Reliability under Thermal Cycling ConditionsMudasir AhmadKuo-Chuan Liu
- Advanced Thin Wafer Support Processes for Temporary Wafer BondingJeremy McCutcheonDongshun Bai
- Selected Applications and Processing for Low Temperature Cofired CeramicKen A. PetersonDaniel S. KruegerCharles E. Sandoval
- Underfill For Ultra-Low Bumped (10μ) 3D PackageMary LiuWusheng Yin
- High Aspect Ratio Package Core Production with Electrolytic Deposited CopperStephen KennyBernd Roelfs
- The Future of Maximum CAD/CAM Automation for Ceramic HybridsJohn Sovinsky
- Enabling Robust Copper Fill of High Aspect Ratio Through Silicon ViasMark WilleyDamo SrinivasSesha VaradarajanDavid PorterEaswar SrinivasanDennis HausmannJon HenriHu KangMayur TrivediTom Mountsier
- Modeling and Optimization of Bond Wires as Transmission Lines and Integrated Antennas at RF/Microwave FrequenciesIvan NdipChristian TschobanStefan SchmitzAndreas OstmannMartin Schneider-RamelowStephan GuttowskiHerbert ReichlKlaus-Dieter Lang
- Validated High Speed Pull and Shear Test Methodologies to Evaluate Pb-Free BGA Mechanical StrengthMudasir AhmadRavi AssudaniDrew NelsonAmir Youssef
- Statistical Analysis Approach to Improve the High Speed Signal Quality by Including the Manufacturing Process Variations of Printed Circuit BoardSeungyong BaekMike SapozhnikovWarren MeggittPhilip PunJason VisneskiRamesh VelugotiAmit Agrawal
- Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal AgingTong JiangFubin SongChaoran YangS. W. Ricky Lee
- Free Air Ball Consistency of Palladium Coated Copper WireJohnny YeungSylvia SutionoEugen Milke
- A Miniaturized Ground Surface Perturbation Lattice for Noise/Coupling Mitigation in Packaging ApplicationsAntonio Ciccomancini Scogna
- A First Individual Solder Joint Encapsulant AdhesiveMary LiuWusheng Yin
- AuSi and AuSn Eutectic Die Attach Case Studies from Small (12 mil) to Large (453 mil) DieDaniel D. EvansZeger Bok
- Advanced 3D Packaging of Miniature Biomedical SensorsDohyuk HaTse-Yu LinByung Guk KimPedro P. IrazoquiWilliam J. Chappell
- A New Coreless Substrate TechnologyBernd K. AppeltAlex S.F. HuangBruce SuYi-Shao Lai
- Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and PadsZheng XuAdam BeeceKenneth RoseJian-Qiang Lu
- Investigation of Silver Migration Impacts on Microwave Systems Fabricated on LTCC Substrate Under High-Power RF Excitation and High Temperature and Humidity Conditions.Deepukumar M. NairK. M. NairKen SoudersMichael SmithMark McCombsJames ParisiTim MobleyBradley Thrasher
- Drop Test Simulation for the Component-Level Reliability of Module PackagesYu GuDaniel Jin
- Study on Thermal Proof of SnO2 Protection Thin Film for Ultra High Reflective Film Ag SystemH. MiyagawaR. SatohY. IwataE. MorinagaS. Kamo
- Characterization of Black Pad Defect on Electroless Nickel- Immersion Gold (ENIG) Plated CircuitsAdam W. MortensenRoger M. Devaney
- Practical Implementation of Frequency Monitoring for Widely Tunable Bandpass FiltersHjalti H. SigmarssonEvan BinkerdJeff MaasJuseop LeeDimitrios PeroulisWilliam J. Chappell
- New GaN Power-Electronics Packaging Solutions: A Thermal Analysis using Raman ThermographyM. FaqirA. ManoiT. MrotzekS. KnippscheerM. MassiotM. BuchtaH. BlanckS. RochetteO. VendierM. Kuball
- Predicting Fusing Current for Encapsulated Wire Bonds under Transient LoadsAditi MallikRoger Stout
- 2nd Level Reliability Improvement on WLCSPSeungwook ParkJupyo HongChangbae LeeSunhee MoonJinsoo KimHyungjin JeonDojae YooYoungdo Kweon
- HIGHLY IONIZED SPUTTERING FOR TSV-LININGMohamed ElghazzaliJürgen Weichart
- Optimization of photovoltaic power generation using a Measurement and Management Technology (MMT) platformLevente J. KleinSergio Bermudez RodriguesSatya NittaRobert SandstromSupratik GuhaHendrik Hamann
- Chip Embedding for Printed Circuit Boards and SubsystemsThomas GottwaldAlexander Neumann
- Investigation on the failure criterion of reliability testing for Pb-free BGA packagesWeidong XieTae-Kyu LeeKuo-Chuan LiuJie Xue
- Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale PackagingPaul Enquist
- Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnectsTae-Kyu LeeWeidong XieThomas R. BielerKuo-Chuan LiuJie Xue
- Inkjet Printing of Thick-Film ResistorsMarcel WassmerWaldemar DielKlaus Krueger
- Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via TechnologyR.K. TrichurM. FowlerJ.W. McCutcheonM. Daily
- Achieving Ceramic-like RF Capacitor Requirements with Organic-based MaterialsJin-Hyun HwangJohn AndresakisBob CarterYuji KageyamaFujio Kuwako
- Using In situ Capacitance Measurements to Monitor the Stability of Thermal Interface Materials in Complex PCB AssembliesMichael GaynesTimothy ChainerEdward YarmchukJohn TorokDavid EdwardsDavid OlsonKatie Pizzolato
- EE Cars Architecture & Linked ECU: Constraints and New NeedsEl Khamis KadiriEric FittererBertrand Delord Manson
- Inkjet Printable Dispersions of Silver and Gold NanoparticlesKrishna BalantrapuLu LuIonel HalaciugaDan V. Goia
- Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element AnalysisAditi MallikRoger Stout
- A Systematic Approach for Creating a System-In-Package (SIP)Sam SadriTri LeStephanie A. Althouse
- The Microelectronic Wire Bond: Past, Present, and FutureHarry K. Charles
- Ferro-Electrically Enhanced Proximity Communication.Ivan ShubinJohn E. CunninghamDarko PopovicHiren ThackerXuezhe ZhengYing LuoJim MitchellKannan RajAshok V. KrishnamoorthySteve ZamekWinnie ChenArka Majumdar
- Hermetic Sealing of Stainless Steel Packages by Seam Seal WeldingThomas MarinisBerj Nercessian
- Interconnect Failure Rate Estimation Based on the Extreme Value DistributionMark PlucinskiMark Hoffmeyer
- High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow UnderfillSangil LeeDaniel F. Baldwin
- Accurate and Efficient BER Calculation by Statistical Simulation Based on Physical Transmit Jitter ModelFangyi RaoSanjeev Gupta
- Direct Printing/Micro-dispensing Solution for 3D Coating ApplicationsXudong ChenKenneth Church
- A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging ApplicationsSyed Sajid AhmadJohn JacobsonZane JohnsonKevin MattsonAaron ReinholzNathan SchneckBernd ScholzGreg Strommen
- Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and AssemblyWeijun ZhouQuan YuanChris LiStephen F. HahnKurt A. KoppiBerend Hoek
- 2 mils Au wire interchip wedge bond cratering studyWang ZhiJieTony LimJiang YingWeiZhang ChangLiangHaengsun ChoiKwansun Hwang
- Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security BumpChunyan NanMichael MayerY. Norman ZhouJairus L. PisiganJohn PersicYoung-Kyu SongHenry Bathan
- Solid-State Formation of Intermetallic Compounds in Co-Sb Couple NanowiresSeong Gi JeonJae Yong SongHo Sun ShinJin Yu
- Nanomaterials for “Green” ElectronicsRabindra N. DasKonstantinos I. PapathomasMark D. PoliksVoya R. Markovich
- Design, Fabrication, Electrical Characterization and Reliability of Nanomaterials Based Embedded PassivesRabindra N. DasJohn M. LaufferSteven G. RosserMark D. PoliksVoya R. Markovich
- High-Dielectric-Constant PLZT Films on Metal Foils for Embedded PassivesBeihai MaManoj NarayananU. (Balu) Balachandran
- Kinetic Heat SinkVijay KhannaGerard McVickerSri M. Sri-Jayantha
- THERMAL MANAGEMENT SOLUTIONS FOR THE LED MARKETK. Andrew KintzSara N. PaisnerM. Shane Thompson
- Fine Feature Solder Paste Printing For Solder Sphere and Solder Trace ManufacturingNicole DallmanKaycie GerstnerKristi JeanFred HaringSyed Sajid AhmadAaron Reinholz
- Metal Coated Polymer Particles for Electronic PackagingIonel HalaciugaKeith RedfordDan V. Goia
- Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumpingJae-Woong NahPeter A. GruberPaul A. LauroClaudius Feger
- Implementation of a Virtual EMI Lab to Cost-Effectively Tackle Multi-Gigahertz EMI ChallengesHany FahmyChen WangDavy PissoortAmolak Badesha
- “Cleaning”- The Dirty Word in Packaging AssemblyRich Brooks
- Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First BenefitsNitesh KumbhatFuhan LiuVenky SundaramVivek SridharanAbhishek ChoudhuryHunter ChanRao Tummala
- Study of Grounding Schemes Utilized in Conformal Shielding ApplicationsScott MorrisDan Carey
- Ink-jetting for Electronic AssemblyGeorg Meyer-BergGottfried BeerKlaus Pressel
- Successful Practices for the Modeling of Printed Circuit Boards and Substrates Using Electromagnetic Field SolversSteven G. PytelScott C. McMorrowTom DagostinoSergey PolstyankoWerner ThielRichard Hall
- A Ceramic Clevis Sensor For Online Substance Concentration Measurement, Manufactured By Ceramic Injection MoldingMatthias HartmannSteffen DoernerSoeren Hirsch
- High via density thin metal-core PCB using electro-coated dielectricBernd ScholzIsmir PekmicSyed Sajid AhmadAaron Reinholz
- The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE ProcessingColin StevensRobert DeanSamuel LawrenceLee Levine
- MEMS Device Sealing in a High Vacuum Atmosphere Achieving Long Term Reliable Vacuum LevelsPaul W. Barnes
- A Method to Quickly Measure the Thickness of Aluminum Bond Pad on Silicon SubstrateSon NguyenZ. Joan DelalicHorst Clauberg
- Immersion Silver as Universal Surface Finish for COB TechnologyJ. GoehreM. Schneider-RamelowK.-F. BeckerM. Hutter
- New Mixed Metal Transition Via-Fill Conductors for Cost Effective DuPont GreenTape™ 951 & 9K7 LTCC CircuitsK. M. NairM.F. McCombsK.E. SoudersS. E. Gordon
- A Novel TSV Etching using NLD and VHF CCP Plasma For 3-D Stacked Devices.Yasuhiro MorikawaTakahide MurayamaManabu YoshiiKoukou Suu
- Laser Patterning and Via Drilling of Sapphire Wafers and DieJustin VignesFred HaringSyed Sajid AhmadKaycie GerstnerAaron Reinholz
- PCB Effects on On-chip Capacitor Requirements and an Efficient Resonance-Prevention ASIC MethodologyTimothy BudellEric Tremble
- Packaging in IBIS-AMI TechnologyDaniel DvorscakDale BeckerMatteo CocchiniSteven G. PytelIsaac WaldronDanil Kirsanov
- Understanding Cleaning of Vias Fabricated Using Micro Mechanical Punching in Liquid Crystal Polymer (LCP) SubstrateMohammad K. ChowdhuryLi SunShawn J. CunninghamAjay P. Malshe
- Low temperature wafer level packaging technology of bulk-micromachined MEMS deviceHeung Woo ParkSeung Hun HanHyun Kee LeeYeong Gyu LeeSeoung Ho KimBok Gun MoonTaek Hee YunMin Seok JangSi Joong YangSang Hun ParkSung Jun LeeWon Kyu JeungJung Won Lee
- TSV Modeling Considering Signal Integrity IssuesIvan NdipBrian CurranKai LöbbickeStephan GuttowskiHerbert ReichlKlaus-Dieter Lang
- Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect StructureEric OuyangMyoungSu ChaeSeng Guan ChowRoger EmighMukul JoshiRob MartinRaj Pendse
- Silicon Micro-Fabrication Technologies for Micro-FiltersBivragh MajeedWim De MalscheLei ZhangPaolo FioriniDeniz Sabuncuoglu TezcanPhilippe Soussan
- The performance over the frequency range 140GHz–220GHz of thick-film CPW lines fabricated from nano-particle silverA. AlshehriM. HoraczekD. RudkaR.J. LeighM. JakubowskaM. SlomaC.E. Free
- Improved Bond reliability through the use of Auxiliary Wires (Security Bumps and Stand-Off Stitch)David J RasmussenRodney Thompson
- Packaging of a Fingerprint Based Access Control SystemZdenka J. DelalicSandeepsarma JosyulaB Anand
- A robust CUP pad structure design with thin pad metal for Cu wire bondingChangHee HanSG KimJH ShimDH JiangSW KoBJ LeeKC KimHG LeeJS YoonBT JiangSW HongHD KimIS YooYS SongDalSoo KimShihyun Choe
- Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder JointsYong JungJin Yu
- Hardware Design for Novel Packaging of Multi-Cellular Meta-Processing UnitSon NguyenJoan DelalicBjorn Gruenwald
- Reliability Modeling to Enable Damage Assessments for Plated Through HolesGilad SharonDonald Barker
- Cost-Effective Alternatives to Palladium Activation – A Study on Autocatalytic Electroless Copper DepositionEdith SteinhäuserT.A. Magaya
- Development of a Low Voiding Solder Attach Process for Photovoltaic Cell AssembliesIan Hardy
- Low Temperature Bonding of High Density Large Area Array Interconnects for 3D IntegrationJason D. ReedMatthew LueckChris GregoryAlan HuffmanJohn M. LannonDorota S. Temple
- Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder JointsS. H. KimJin Yu
- Creating 3D specific systems: Architecture, Design and CADPaul D. FranzonW. Rhett DavisThor ThorolfssonSamson Melamed
- BRAIDED ELECTRICAL CONTACT ELEMENT BASED HIGH PERFORMANCE CONNECTORSMichael SalloumChe-Yu Li
- Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer IntegrationZhaozhi LiBrian J. LewisPaul N. HoustonDaniel F. BaldwinEugene A. StoutTheodore G. TessierJohn L. Evans
- Correlation of Dispense Characteristics of Conductive Inks to Substrate TemperatureFred HaringJustin VignesSyed Sajid AhmadArun ShankaranKaycie GerstnerNicole DahlmanAaron Reinholz
- Advanced microfluidic packaging for molecular diagnosticsM. PalmieriT. BarbuzziA. MaiernaM. MarchiG. MontalbanoG. PanviniT. RodenfelsW. Stoeters
- Electrical Demonstration of TSV Interconnects and Multilevel Metallization for 3D Si Interposer ApplicationsErik VickScott GoodwinDorota Temple
- Effect of Dielectric Selection on Sintering Behavior of LTCCDaniel S. KruegerLaura AgeeCristie FadnerJ. Brent DuncanKen PetersonGreg HilmasShi C. ZhangWayne Huebner
- Improved Design of a High Density 3D Multichip Module for Class I Medical DevicesDoug LinkMichael Kollar
- Structural Electronics through Additive Manufacturing and Micro-DispensingRichard OlivasRudy SalasDan MuseEric MacDonaldRyan WickerMike NewtonKen Church
- A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold processJ. H. KimK. H. KimJin Yu
- Global Technology Survey of Anisotropic Conductive Interconnect Technologies, Past Present and Future - An Industry Intellectual Property ApproachEdmar M. AmayaGene A. Lang
- Debye Model Fitting for Time-Domain Modeling of Lossy DielectricsA. Ege Engin
- Electromigration Performance of Pb-Free μPILR™ Flip-Chip PackagesRajesh KatkarLaura Mirkarimi
- Modeling of a heterojunction bipolar transistor based AlGaAs / GaAsA. BediaD. GhaffourA. Guen-BouazzaB. BouazzaK. Ghaffour
- Next Generation High Dk, Low Df Organic Laminate for RF Modules and High Frequency ApplicationsFuhan LiuVivek SridharanTapobrata BandyopadhyayVenky SundaramRao TummalaKiyoshige KojimaNaomi ShigaToshihiko Jimbo
- Improvements in Solid State Lighting Applications with the use of Traditional Thick Film Technology.Sarah GromanNeil Jones
- Identifying and Working with Government RegulationsKelly Raia
Elghazzali, Mohamed, and Jürgen Weichart. 2010. “HIGHLY IONIZED SPUTTERING FOR TSV-LINING.” IMAPSource Proceedings 2010 (1): 185–91. https://doi.org/10.4071/isom-2010-TP1-Paper5.