Fine Pitch Cu Wire Bonding – As Good As Gold

Appelt, Bernd K., William T. Chen, Andy Tseng, and Yi-Shao Lai. 2010. “Fine Pitch Cu Wire Bonding – As Good As Gold.” IMAPSource Proceedings 2010 (1): 650–55. https:/​/​doi.org/​10.4071/​isom-2010-WP4-Paper1.