Vol. 2010, Issue 1, 2010January 01, 2010 EDT
A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging Applications
A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging Applications
Syed Sajid Ahmad, John Jacobson, Zane Johnson, Kevin Mattson, Aaron Reinholz, Nathan Schneck, Bernd Scholz, Greg Strommen,
Ahmad, Syed Sajid, John Jacobson, Zane Johnson, Kevin Mattson, Aaron Reinholz, Nathan Schneck, Bernd Scholz, and Greg Strommen. 2010. “A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging Applications.” IMAPSource Proceedings 2010 (1): 638–45. https://doi.org/10.4071/isom-2010-WP3-Paper5.