Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology
Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology
Trichur, R.K., M. Fowler, J.W. McCutcheon, and M. Daily. 2010. “Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology.” IMAPSource Proceedings 2010 (1): 192–96. https://doi.org/10.4071/isom-2010-TP1-Paper6.